Molex Partners with Radiall to Expand the SMP-MAX Series

The SMP-MAX connectors from Molex (News - Alert) provide the largest misalignment tolerance in the industry, for simple and dependable connections, even in blind-mate applications. Inexpensive SMP-MAX connectors provide a patented impedance matching insulator optimized for a huge operating gap between connectors. The operating gap is capable of handling a maximum board-to-board tilt (radial travel) of four degrees and up to 2.00mm of distance (axial) misalignment without a spring.

Recently, the company announced a partnership with Radiall to expand the SMP-MAX series. This partnership will provide new symmetrical adapters and RF coaxial interconnect solutions for board-to-board, module-to-module and panel-to-panel telecom applications, the company stated in a press release.

During manufacturing, the new SMP-MAX symmetrical adapters get rid of the dangers of assembly errors. Making SMP-MAX one of the fastest growing series in the RF industry, Molex has more than 80 specific SMP-MAX connector designs which were created for global telecom customers. As an inexpensive solution adaptable to virtually any configuration, SMP-MAX is currently being installed in various wireless telecom projects in North America, Europe and Asia, the company stated.

“We’ve grown the SMP-MAX connector family substantially with over 80 specific designs, which were developed over the past 18 month period,” said Roger Kauffman, marketing and sales manager for RF Products, Molex, in a company press release. “As with the all of our Molex SMP-MAX connectors, the new products offer the largest misalignment tolerance in the industry for simple and reliable connections even in blind-mate applications.”

Recently, TMC (News - Alert) reported that the company announced the availability of zSFP+ (Small Form-factor Pluggable Plus) SMT (Surface Mount Technology) 20-circuit connectors. For total backward compatibility as a drop-in replacement for current SFP+ form factor host board designs, the zSFP+ SMT 20-circuit connector features the same PCB footprint, mating interface and EMI cage dimensions. The high-temperature thermoplastic housing can withstand lead-free processing.