Molex (News
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For total backward compatibility as a drop-in replacement for current SFP+ form factor host board designs, the zSFP+ SMT 20-circuit connector features the same PCB footprint, mating interface and EMI cage dimensions. The high-temperature thermoplastic housing can withstand lead-free processing.
To accommodate server and switch applications at a cost comparable to SFP+ cages, single-port and 1x ganged cages support multiple port count applications and options for use with various board thicknesses and assembly processes, the company stated in a press release.
“SFP connectors and stacked integrated connectors have undergone major design enhancements to achieve and optimize next-generation performance,” says Joe Dambach, new product development manager, Molex in a company press release. “The new zSFP+ SMT technology offers a fully integrated solution to upgrade and design storage, switches, routers and hubs in central office and multi-platform data systems.”
Like the SFP+ form factor, backward compatible zSFP+ connectors share the same mating interface and EMI cage dimensions. While greatly reducing resonance compared to current SFP+ products, the zSFP+ connectors feature a preferential coupling design using insert molding and a narrow edge-coupled blanked and formed contact geometry for superior signal, mechanical and electrical performance.
Components of the new zSFP+ interconnect system include: zSFP+ SMT 20-circuit connectors, stacked integrated connectors and passive optical cable assemblies.
Recently, the company announced that its new Brad HarshIO Ethernet I/O Module with QuickConnect and fast start-up technology can ensure reliable connection between industrial controllers and I/O devices in harsh environments that are often disturbed by liquids and vibrations.
The new modules bring high speed to the market and versatility to all industries using robots for repetitive tasks with precision and they have been successfully tested with Rockwell and Siemens (News
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