infoTECH Feature

December 16, 2009

Comneon Unveils 3GPP Rel-7 Dual Mode Protocol Stack supporting HSPA+ and EDGE Evolution

Comneon, a fully owned subsidiary of Infineon Technologies (News - Alert) AG and a supplier of protocol stack software for mobile communications, has reportedly launched a 3GPP Rel-7-compliant Dual Mode Protocol Stack supporting GSM, GPRS, EDGE and EDGE Evolution -- as well as FDD WCDMA with HSDPA, HSUPA and HSPA+.
 
Comneon’s Dual Mode Protocol Stack Family includes solutions that are in compliance with 3GPP GSM, GPRS, EDGE and WCDMA FDD specifications. The company has nearly 17 years of experience in providing mature protocol stacks for 2G and 3G UMTS/WCDMA specifications. Comneon’s Rel-7 Dual Mode Protocol Stack (DM-PS 7.0) is said to have implemented the most recent HSPA+ and EDGE Evolution features which further improves the mobile internet experience of 3G mobile communication systems.
 
The new release, as stated by company officials, features higher data rates, increased spectral efficiency, lower latency and reduced power consumption -- key benefits for end users and operators alike.
 
“The various enhancements introduced by 3GPP like HSPA+ offer substantial performance and user experience improvements while they are still based on mature 2G and 3G radio network technologies,” said Christian Mucke, managing director of Comneon. “With the availability of our Rel-7 Dual Mode Protocol Stack software we once more have demonstrated Comneon’s technology leadership in the field of mobile communication protocol stack solutions.”
 
Additionally, company officials also clarified that operators would now be finding the launch of HSPA+ to be a very economic upgrade path towards LTE (News - Alert)-like performance, since most features require a software upgrade only for RNC and NodeB equipment.
With data rates up to 28 Mbit/s in downlink and 11 Mbit/s in uplink 3GPP Rel-7 HSPA+ systems double the peak data rate parameters of a Rel-6 network while latency is about halved with values down to levels below 50ms.
 
Moreover, the use of higher order modulation schemes, multiple antennas (MIMO technology) and increased logical link layer efficiency are factors that facilitate these processing improvements.

Jai C.S. is a contributing editor for TMCnet. To read more of Jai's articles, please visit his columnist page.

Edited by Marisa Torrieri
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