Qualcomm Sampling Industry's First Dual-carrier HSPA+, Multi-Mode 3G/LTE Chipsets for Global Markets

Qualcomm Incorporated, a developer of advanced wireless technologies, products and services, has reportedly announced that it is sampling the first chipsets for dual-carrier HSPA+ and multi-mode 3G/LTE (News - Alert).

 

The Mobile Data Modem MDM8220 solution is the first chipset to support Dual-carrier High-Speed Packet Access Plus and the MDM9200 and the MDM9600 chipsets are the industry's first multi-mode 3G/Long Term Evolution solutions.

 

Qualcomm's (News - Alert) MDM8220 dual-carrier HSPA+ solution, based on the 3GPP Release 8 standard, is said to provide peak downlink data rates of up to 42 megabits per second and 11 Mbps on the uplink, allowing carriers to easily upgrade their existing infrastructure equipment to achieve significantly higher bandwidths. Its dual-carrier technology is capable of doubling the networks' bandwidth from 5 MHz to 10 MHz by aggregating two HSPA carriers in parallel.

 

The MDM9200 and the MDM9600 chipsets is reportedly the industry's first multi-mode 3G/LTE solutions, the company said. It lets UMTS and CDMA2000 operators upgrade to future LTE services and also preserve backward compatibility to their existing 3G networks. MDM9200 supports UMTS, HSPA+ and LTE, while the MDM9600 supports CDMA2000 1X, EV-DO Rev. B, SV-DO, SV-LTE, UMTS, HSPA+ and LTE.

 

Reportedly, all of the new chipsets support FDD LTE and TDD LTE modes and different carrier bandwidths, and are capable of using orthogonal frequency division multiple access and multiple-input and multiple-output antenna technology to support peak data rates of up to 100 Mbps on the downlink and 50 Mbps on the uplink.

 

Dual-carrier HSPA+ and LTE are capable of providing the ability to deliver more advanced data capabilities to mobile devices, supporting more compelling applications and richer user experiences. A wide variety of network operators, infrastructure vendors and mobile device manufacturers are said to be working with Qualcomm to aid deployment of these next-generation network technologies in new markets worldwide.

 

Interoperability testing with infrastructure partners is already underway with multiple field trials scheduled for the first half of next year. The company also said that the commercial launches of data-centric devices based on Qualcomm's MDM solutions will soon begin from the second half of 2010.

 

The company also said that there is significant progress toward allowing mass-market commercial deployment of two next-generation network technologies that can offer advanced data capabilities to mobile devices for new global markets in addition to North America.

 

"Qualcomm leads the industry in enabling next-generation mobile experiences with highly integrated, powerful and elegant solutions for dual-carrier HSPA+ and LTE. We are pleased to be working with so many industry leaders to bring these advanced technologies to market," said Alex Katouzian, vice president of product management, Qualcomm CDMA Technologies, in a statement. "We remain committed to CDMA and OFDMA WAN modem leadership and the seamless and cost-effective commercialization of next-generation technologies around the world."

 

In other news, Qualcomm Incorporated recently appointed Warren Kneeshaw as the vice president of Investor Relations within the Company's global marketing & investor relations group. Founded in 1985, Qualcomm’s current intellectual property portfolio is said to include more than 11,000 United States patents for wireless technologies, with more than 175 telecommunications equipment manufacturers licensing them worldwide.