Bsquare Debuts Windows Embedded CE 6.0 R3 Board Support Package for TI Plaftform

Bsquare Corp. reportedly announced the availability of an optimized Microsoft (News - Alert) Windows Embedded CE 6.0 R3 board support package for the Texas Instruments OMAP 3 evaluation module.

 

“Bsquare’s BSP allows us to differentiate our OMAP 3 platform for a wide range of device manufacturers who want the benefits of speed and high performance coupled with rich Internet applications, immersive user experience and seamless connectivity to other Windows PCs, servers and online services,” said Gerard Andrews, manager for OMAP 3 product line at TI, in a statement.

 

The new Windows Embedded CE 6.0 R3 BSP ships with OpenGL ES 2.0 technology. Company officials said that the technology takes advantage of the TI OMAP35x 3D PowerVR SGX graphics engine, which allows OEMs to use advanced Silverlight for Windows Embedded user interface solutions on the TI hardware.

 

Additionally, the new BSP also supports Internet Explorer Embedded, Microsoft Office and PDF Viewers and Tencent’s QQ Messenger Client.

 

Original equipment manufacturers gain a “significant” time-to-market advantage with Windows Embedded CE 6.0 R3 and the TI OMAP3 platform as building blocks, according to Raj Khera, vice president of products at Bsquare.

 

He said that using familiar development tools and leveraging the high-performance graphics and advanced multimedia support the new BSP helps OEMs and ODMs create differentiated devices that feature “compelling” experiences.

 

Bsquare is a provider of engineering services and production-ready software products for the smart device market. Bsquare is also a licensing distributor of Windows Embedded CE 6.0 R3. The company offers Microsoft’s complete line of software products for embedded systems to OEMs in North America.

 

This year in March, Microsoft selected Bsquare as a Microsoft Auto training partner. As a partner, the company is developing multiple levels of training courses for automakers, automotive suppliers and a growing ecosystem of partners developing the future of in-car technology.