Bell Microproducts Expands OEM Ready Programs and Product Offerings

Bell Microproducts Inc., an international, value-added distributor of a wide range of high-tech products, solutions and services, has expanded its OEM-Ready programs and product offerings.

Officials said that working with HP, Bell Microproducts is introducing "Build OEM Better" (BOB), a program in which the company will leverage its insight and access into embedded system manufacturers with HP's technology components to offer unique ROI advantages to OEM business teams.

"Bell Micro continues to define its real value-add role in the technology chain between technology manufacturers and OEM/VAR customers, with the continued expansion of its OEM-Ready programs defined as part of the BOB initiative,” said Gary Gammon, senior vice president of enterprise marketing for Bell Microproducts.

Gammon said that by applying the knowledge of how OEMs operate their businesses, Bell Micro has been able to define and offer OEM-specific services, which help them to save costs and increase their competitiveness.

According to company officials with the Bell Micro OEM-Ready program, customers have the ability to quickly respond to custom requests as well as lower costs and accelerate delivery time.

Officials said that by offering access to HP-branded technology combined with services such as product design, assembly, shipment, service and support, Bell Micro is uniquely positioned to assist its customers in bringing their products to market.

"OEMs can rarely foresee the hidden challenges and complexities that building their own off-the-shelf 'white box' systems entail," said Jerome Wendt, president and lead analyst for DCIG.

Wendt said that Bell Micro and HP's new BOB program removes these complexities while giving them a trusted partner upon whom they can rely.