200 Millionth Murata-CSR Module Rolled Out

CSR and Murata (MRAAF) have announced the production of the 200 millionth module to combine CSR (News - Alert) and Murata technology.

 

Murata produces a wide range of modules for mobile phones, PC, automotive and other applications using CSR’s Bluetooth chips. The CSR semiconductors used in Murata’s designs are extremely small, power-efficient and are known for delivering high performance.

 

Matthew Phillips, senior vice president of the Handset Business Unit at CSR, noted that OEMS have begun to associate Murata’s name with build-quality, performance and power-efficiency. He said that similar to CSR, Murata takes a customer-centric approach, and does everything in its capacity to minimize costs and time-to-market.

 

“Having shipped our own billionth chip a few months ago, we’re proud to be marking this joint milestone with our valued long-term partner,” he added.

 

CSR produces the smallest and most integrated Bluetooth and connectivity chips. The company has been doing so consistently and has been able to achieve this by combining its ‘Smart Integration’ approach to silicon design and leveraging its Wafer Level Chip Scale Packaging (WLCSP) technology.

 

According to CSR, WLCSP has the ability to achieve the smallest PCB footprint and is a popular packaging technology for high volume, and small form factor devices such as mobile handsets. CSR is making efforts to further reduce the height of WLCSP packages.

 

Both Murata and CSR have worked closely together almost since CSR’s inception, and have a close and highly productive relationship. CSR has worked with Murata on its Connectivity Centre product, CSR9000, which was launched this year at Mobile World Congress (News - Alert). The company claims their CSR9000 to be the world’s smallest Bluetooth and Wi-Fi solution. CSR9000 can support a number of connectivity technologies such as Bluetooth, Bluetooth low energy, Wi-Fi (IEEE (News - Alert) 802.11abgn) and FM receive and transmit.

 

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