Numonyx to Deploy Elpida's Hiroshima Plant to Produce NOR Flash Memory

Elpida Memory, a manufacturer of Dynamic Random Access Memory (DRAM) integrated circuits, has announced it has signed a foundry agreement with Numonyx B (News - Alert).V., a manufacturer of integrated NOR, NAND and non-volatile memory technologies and products.

 

According to the agreement, Numonyx will utilize Elpida’s leading-edge wafer facility in Hiroshima to manufacture NOR flash memory. The formal signing finalizes the letter of intent announced in July.

 

Numonyx will now be able to access increased 300mm capacity while reducing the costs to make high-density NOR flash commonly used in mobile phones and embedded applications.

 

Elpida Memory's 300mm manufacturing facilities, consisting of its Hiroshima Plant and a Taiwan-based joint venture, Rexchip Electronics, utilize advanced manufacturing technologies available.

 

Its Hiroshima plant has been certified by British Standards Institution as being in full compliance with the requirements of the ISO9001:2000 and ISO14001:2004.

 

The plant has extensive capacity of approximately 120,000 wafers per month, a part of which will be allocatd to Numonyx for the production of both 65nm NOR flash products as well as NOR flash products on the upcoming 45nm process technology.

 

Technology transfer and development activities for Elpida’s Hiroshima Plant have been started by both the companies, and initial production is being planned to begin in the middle of next year.

 

Numonyx will be able to have a considerable competitive advantage deploying the combination of leading lithography and the industry-leading 300mm sized wafers.

 

Elpida provides DRAM solutions across a wide range of applications, including high-end servers, mobile phones and digital consumer electronics. The portfolio of its solutions features high-density, high-speed, low power and small packaging profile products.

 

Numonyx designs and manufactures memory products to meet the increasingly sophisticated needs of customers in the wireless, data and embedded markets.

 

The company integrates technology and manufacturing expertise of the flash memory divisions of Intel (News - Alert) Corporation and STMicroelectronics in its product development. It primarily focuses on providing high density, low power memory technologies and packaging solutions to its customers.