), an integrated circuit company, is set to join IMEC's industrial affiliation program (IIAP) on three-dimensional (3D) integration.
Under the program, Qualcomm and IMEC researchers will work together to develop solutions for the use of 3D technologies in future wireless products. IMEC is an independent nano-electronics research institute in Europe.
"Now that Qualcomm, the world's leading fabless integrated circuit provider, has joined the 3D integration program, we have all the major supply chain players working together," said Luc Van den hove, chief operation officer at IMEC. "We are confident that strong industry collaboration among foundries, IDMs, packaging and assembly companies, and equipment suppliers at IMEC will push the development of innovative 3D products forward."
IMEC's 3D integration program explores three-dimensional technology and design for application in various domains. The technology research program concentrates on 3D wafer-level packaging and 3D stacked-ICs to devise solutions for the use of 3D interconnects at different levels of the wiring hierarchy.
"Three-dimensional design will allow Qualcomm to offer superior features and performance in our products," said Jim Clifford, senior vice president and general manager, Qualcomm CDMA Technologies. "We are collaborating with IMEC because their research and technology expertise will help us to accelerate the implementation of 3D design in our products."
Other partners in IMEC's 3D integration program are Amkor, Infineon, Intel (News
), Micron, NEC, NXP, Panasonic, Qimonda, Samsung, ST Microelectronics, Texas Instruments and TSMC.
Niladri Sekhar Nath is a contributing writer for TMCnet covering telecommunications, service providers and networking. To see more of his articles, please visit his columnist page.
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