Molex (News - Alert) launched new HOZOX electromagnetic interference (EMI) absorption tapes and sheets which are imperative for manufacturers of high-frequency equipment in the medical, consumer electronics, data/telecommunications and microwave/radio frequency industries.
High-frequency noise occurs owing to the addition of too many functions into smaller device designs and due to increased operating frequencies of integrated circuits.
Joe Falcone, product manager, Molex said, “While noise might be controlled at the board level, secondary interference can cause functional faults, especially when multiple boards are connected through a bus or mounted together. Sometimes the noise even exceeds limits defined in Federal Communications Commission or other industry regulations.”
“This means there’s a growing need for EMI noise-suppression solutions that can act to absorb broadband-radiated noise,” Falcone pointed out.
Officials explained that the HOZOX absorption technology optimizes the EMI noise mitigation performance by leveraging a unique dual-layer design. Also the magnetic layer’s powder composite can absorb lower frequency electromagnetic energy. The conductive layer’s powder and high loss dielectric resin is capable of absorbing high frequency electromagnetic energy.
The tapes and sheets have a thin form factor and are available in two different tape formats and in A4 sheet format which can be die-cut according to required configurations.
The dual-layer structure absorbs MHz and GHz electromagnetic energy thereby delivering ultra-wideband EMI noise mitigation. As the HOZOX absorption tape and sheets are insulated on one side they can be closely packed with low-power active components like noisy digital or analog integrated circuits.
Also the HOZOX technology coverts some of the electromagnetic waves it absorbs into heat which is however not harmful to the surroundings. The technology is lead-free featuring RoHS 2011/65/EU compliance and with UL 94V-0 equivalent for flammability.
The HOZOX EMI absorption tape and sheets are suitable for use in medical devices, flat-panel flex cables, radiology equipment, printed circuit boards/enclosures and high speed switches, hubs and servers.
Recently Molex announced that its SpeedStack mezzanine connector system provides a low profile solution for PCB space savings and a narrow body width for optimized airflow in high-speed and very dense applications. The compact SpeedStack connectors feature a stack height of 4.00mm and support data rates up to 40 Gbps per differential pair.