Camtek's Xact200 Systems Receive Repeat Orders from Semiconductor Manufacturers

Camtek has received repeat orders in excess of $2.5 million for Xact200 systems from a number of leading semiconductor manufacturers.

“These repeat orders are a vote of confidence in our technology from some very important customers, especially in light of the challenges we faced with the Xact200 last year,” said Roy Porat, CEO at Camtek, adding that the company’s R&D efforts have yielded a mature, cutting-edge technology system.

Camtek’s next generation TEM Sample Preparation System Xact200 performs cutting-edge TEM/STEM sample preparation in line with the semiconductor and nanotechnology roadmap requirements for next generation physical FA and characterization.

Company officials said that it combines the adaptive ion milling (AIM) technology with an integrated FE SEM column, in-process STEM imaging capability and piezzo-based multi-axis manipulator. AIM technology offers an innovative solution for physical failure analysis and characterization.

In addition to routine lamella thinning to below 20nm covering a wide region of interest, the system also offers the advantage of high precision milling with integrated FE SEM/STEM for site-specific applications; enhanced lamella thickness uniformity and robustness; high effective throughput with breakthrough end-point detection; and more.

Camtek is a provider of automated and technologically advanced solutions dedicated to enhancing production processes and increasing yields, enabling and supporting customer's latest technologies in the semiconductors, printed circuit boards (PCB) and IC Substrates industries.

The company’s solutions range from micro-to-nano by applying its technologies to the industries' specific requirements.

This year in April, the company said that it received an order and completed the installation of the Xact200 system. Porat said that Camtek penetrated the sample preparation market with the acquisition of SELA in 2010.