Eric Marcelot, head of Semiconductor Marketing at e2v, said in a statement, “We are pleased to add PC8378 and PC8379 communications processors to our portfolio of high reliability processors. A broad range of communications applications in the aerospace and defense industries can now benefit from these sub 5W devices as a cost-effective system-on-chip solution, offering an adequately sized computation capacity together with useful integrated PCI (News - Alert)-Express and SATA features.”
These processors ensure high reliability for networking applications in aerospace, defense and demanding outdoor environments. The PowerQUICC II Pro PC8378 and PC8379 processors are optimized to function in the sub 5 watt power category. The software compatibility with PC603e allows for easy system upgrades at minimal software qualification cost.
The communications processors are based on a Power Architecture e300c4s processor core that operates at frequencies of up to 800MHz featuring PCI Express and serial-ATA (SATA) controllers. They also have dual Gigabit Ethernet controllers and are built on Freescale’s 90nm technology, which is power conscious.
Freescale’s 90nm CMOS on SOI process technology was used in the manufacture of the PC8378 and PC8379 communications processors. The processors are capable of functioning in an extended temperature range between -40°C and +125°C. They are available in a FC-PBGA 689 pin package.
Also, e2v is expected to release non-RoHS packaged versions with SnPb lead finish, which will function over a full military temperature range of -55°C to +125°C.
“This is part of our long-term agreement with Freescale and will be embedded within our Semiconductor Lifecycle Management program (SLiM), securing long-term availability,” added Marcelot.
e2v delivers specialist technology for high-performance systems and equipment required for applications in medical, science, aerospace, defense, commercial and industrial markets.
Recently, e2v announced it is qualified to offer QorIQ processors, which have undergone de-balling and re-balling processes. It overcame numerous reliability challenges associated with the process, such as coplanarity, compliance on large packages in excess of 1000 balls, pitch accuracy, lid attach reliability issues and occurrence of whiskers around the balls near the package edges and between lid and substrate.
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