Applied Nanotech Debuts THERCOBOND Thermally Conductive Bonding Materials

Applied Nanotech Holdings announced the launch of a new family of thermally-conductive bonding and printed materials called THERCOBOND, suitable for power electronics and photonics applications.

“The implementation of new thermal interface composites with a significantly higher level of heat dissipation performance is critical for the extreme requirements of power electronic devices today,” said Dr. Nan (David) Jiang, Director of the Thermal Management Division at Applied Nanotech.

“The scope of industrial and commercial applications for THERCOBOND materials is immense, starting with electronic packaging, power LEDs and PCB assembly, just to name a few,” Jiang added.

Officials highlighted the advantages of THERCOBOND materials, designed for power electronic device packaging and dielectric coating. They are optimized for providing required thermal conductivity, thermal diffusivity, thermal expansion, dielectric and insulating properties and printability.

They can be applied on various substrates by using methods such as conventional screen printing, drawdown and even inkjet and other printing processes. This results in the formation of thermally conductive dielectric layers for printed circuit board (PCB) applications, besides being useful for electronic packaging.

Polymer-based (DTC-P) and ceramic-based (DTC-C) products belong to the THERCOBOND family. DTC-P consists of thermally conductive, electrically insulating materials. They leverage the properties of dielectric polymers that are modified to optimize thermal conductivity properties, and enable easy adhesion and wettability to metals, semiconductors and graphitic substrates like CarbAl.

Officials explained that DTC-C forms a group of thermally conductive, electrically insulating materials based on dielectric ceramics. They offer optimum thermal conductivity, excellent adhesion and wettability to semiconductors, and graphitic substrates.

DTC-C is a one-part bonding material featuring a low CTE, which is less than 7 ppm/K after curing. It is also highly heat-resistant and can work up to a temperature of 400 degrees Celcius.

“With the global market for thermal interface materials projected to be over $600 million by the year 2016, the potential market for THERCOBOND materials is very large,” said Doug Baker, CEO at Applied Nanotech Holdings. “The THERCOBOND family of products now joins our award-winning thermal management material CarbAl and our ultra-strong adhesive CNTstix in our growing list of superior performance products, based on our nanotechnology innovations.”

Last March, Applied Nanotech Holdings unveiled the next generation of CarbAl, a heat transfer material with a combination of low density, high thermal diffusivity, high thermal conductivity and a low coefficient of thermal expansion (CTE). The product offers a material that exceeds the abilities of traditional passive thermal management materials.