infoTECH Feature

March 28, 2011

Texas Instruments Selects IDT RapidIO Gen2 Switch

Texas Instruments (News - Alert) (TI) has selected the IDT CPS-1616 RapidIO (News - Alert) Gen2 switch for its new TMDXEVM6616 evaluation module (EVM), IDT announced in a press release.

The IDT CPS-1616 provides a full, non-blocking bandwidth of 80 Gbps for up to 16 ports. The device uses a 5th generation switch fabric, building upon Gen1 CPS and Tsi switching architectures. This new switch uses patent pending features to minimize latency, ensure scheduling fairness, and provide superior multicast throughput.

Supporting up to 20 Gbps per link for use as a chip-to-chip, board-to-board, and chassis-to-chassis interconnect, the IDT CPS-1616 belongs to IDT’s extensive portfolio of RapidIO Gen2 switches. While providing high reliability, very low 100ns cut through latency, and simplified system memory maps, RapidIO enables OEMs in the 4G wireless and industrial markets to design embedded systems with clusters of DSPs that communicate in a peer-to-peer fashion.

“We’re pleased that TI has selected IDT’s RapidIO switch for its wireless base station reference design,” said Fred Zust, vice president of the Communications Division at IDT. “RapidIO is the ideal choice for clustering endpoints that require peer-to-peer communication, reliability, scalability, and high-performance in a single interconnect. Customers continue to make use of RapidIO as the primary interconnect due to the advantages it offers.”

Within the wireless infrastructure market, the use of RapidIO in TI’s TCI6616 EVM is a testament to the widespread adoption of the interconnect standard, the company said. RapidIO is the most effective interconnect choice for today’s wireless systems as it provides inherent efficiency and software scalability in clustering large numbers of digital signal processors (DSPs) and Field Programmable Gate Arrays (FPGAs) on boards and over backplanes, the company stated.

Recently, the company announced that its IDT TSI578 RapidIO switch was selected by RADVISION, a provider of unified video communications solutions, for use in its SCOPIA Elite multipoint video conference system. The IDT TSI578 is noted as a third generation RapidIO switch used as a chip-to-chip, board-to-board, and chassis-to-chassis interconnect supporting up to 80 Gigabits per second of full duplex aggregate bandwidth.

Raju Shanbhag is a contributing editor for TMCnet. To read more of Raju’s articles, please visit his columnist page.

Edited by Janice McDuffee

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