X-ES Unveils Intel Core i7 Processor-Based CompactPCI Module, XPedite7330

Extreme Engineering Solutions, Inc. (X-ES (News - Alert)), a designer and a builder of chassis, single-board computers, I/O, power, backplane, and system-level products, introduced a new conduction- or air-cooled 3U CompactPCI (News - Alert) Single Board Computer (SBC) XPedite7330, ideal for air-cooled, industrial and communications applications.

The new 3U CompactPCI SBC is based on the Intel (News - Alert) Corei7 processor and Intel QM57 chipset. This SBC delivers enhanced performance and efficiency for air-cooled, industrial and communications applications due to Core i7 processor with dual cores operating at 2.53, 2.0, or 1.06 GHz.

According to X-ES, the XPedite7330 is engineered to scale from an air-cooled, commercial to a rugged, conduction-cooled version with appropriate environmental test methods, in order to gratify the widest range of applications, from telecommunications to military applications.

Apart from featuring Intel Core i7-610E, -620LE, and -620UE processors and dual-core with hyper-threading technology, the XPedite7330 also features up to eight GB of DDR3-1066 ECC SDRAM on two channels and up to 16 GB of NAND flash and 32 MB of redundant NOR flash.

In addition to XMC/PrPMC site, the XPedite7330 is also provided with two Gigabit Ethernet ports, two serial ports, two USB ports, four SATA ports, four GPIO ports and one DVI port.

The operating system support provided to XPedite7330 includes Green Hills INTEGRITY Board Support Package (BSP) Wind River (News - Alert) VxWorks BSP, QNX Neutrino BSP, Linux BSP and Windows drivers.

The XPedite7330 can be deployed in conduction-cooled military applications as well.

In recent news, X-ES announced the availability of XCalibur4301 conduction- or air-cooled 6U CompactPCI SBC. Based on the Intel Corei7 processor, this SBC is ideal for ruggedized systems requiring high bandwidth processing and low power consumption, and a powerful solution for the next generation compute intensive embedded applications.

In addition, X-ES also announced the introduction of Avionics Development Platform to enable the development and rapid deployment of avionics systems. This new prepackaged 3U OpenVPX development platform offers functionality and I/O commonly required by avionics applications.