infoTECH Feature

September 15, 2010

Intel Outlines Atom Based SoC chips, Opens Online Apps Center

This week at the Intel (News - Alert) Developer Forum (IDF 2010) in San Francisco, Intel executives are outlining several software- and hardware-related efforts as the semiconductor giant intensifies its system-on-a-chip (SoC) product plans based on the Atom processor family.

Renée James, senior vice president and general manager, Intel Software and Services Group, and Doug Davis, vice president and general manager, Embedded and Communications Group, discussed the expansion of these processors into consumer applications such as netbooks, tablets, smart phones and other similar mobile devices.

During her keynote at Moscone Center West, James outlined how tightly integrated and optimized software and platforms will deliver new levels of performance, along with fresh capabilities and the importance of creating an innovative experience across the personal computing continuum – from PCs to smart phones to tablets and cars, as well as any number of Internet-connected consumer devices.

Emphasizing a seamless experience across operating systems, James also unveiled Intel AppUp center, a netbook online app store for consumers. The Intel AppUp center includes both free and paid apps for entertainment, social networking, gaming and productivity, optimized for a netbook’s mobility and screen size, said the keynoter. To encourage consumers to try new applications, Intel AppUp provides “try before you buy” solutions, encouraging consumers to purchase apps they otherwise might not have. The launch was also marked by the availability of Adobe AIR applications, as well as apps from companies including Accuweather, Barnes & Noble, Funkitron, Gibson Guitars, iWin, Kaplan, KONAMI, and Lifetime.

In an effort to reach netbook owners worldwide, James announced agreements with Best Buy (News - Alert), UK-based Dixons and India-based Croma to outfit each retailer with the Intel AppUp center – pre-installed on netbooks the stores sell, as well as available for current netbook owners to download online. Similarly, she also revealed plans from ASUS to ship its version of the Intel AppUp center on netbooks, the “asus app store,” starting in October.

 Likewise, Davis introduced Atom based SoCs for applications beyond PCs. For instance, he presented a new Intel Atom E600 SoC processor series tailored for embedded applications such as in-vehicle infotainment systems for cars, smart grid devices and IP media phones. The SoC integrates additional capabilities onto the chip and features an open interconnect for added flexibility, making it easier to design with chips from suppliers like OKI Semiconductor, Realtek Semiconductor and STMicroelectronics (News - Alert). While chips from Dialog Semiconductor and ROHM Co.are designed to regulate voltages and synchronize clocks, according to Davis.

In addition, Davis also provided details on an upcoming new configurable Atom processor, codenamed “Stellarton. The processor consists of the Atom E600 processor paired with an Altera (News - Alert) FPGA in a multi-chip package; which provides additional flexibility for customers who want to incorporate proprietary I/O or acceleration. And enables developers to differentiate their designs by reacting quickly to changing requirements.

Intel Atom processor CE4200, formerly codenamed “Groveland, was also introduced. Designed to enable seamless integration of Internet experience and TV, the SoC includes 3-D support, H.264 high-definition encoding capability for usage models such as “sync-and-go” between networked consumer electronics and portable devices, and multiple input stream support to enable the design of cost-effective home gateway appliances. To help address regulatory requirements, the SoC features smart power management capabilities that automatically help to turn off parts of the chip when not in use. A software development kit and familiar tools for integrating applications is also available.


Ashok Bindra is a veteran writer and editor with more than 25 years of editorial experience covering RF/wireless technologies, semiconductors and power electronics. To read more of his articles, please visit his columnist page.

Edited by Ed Silverstein
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