NeoPhotonics Enhances its XFP Pluggable Transceiver Line with New CWDM and DWDM Options

To meet the increase in demand for high-speed 10 Gigabit network connections like OC192/STM-64, 10 G Fiber Channel, G.709, and 10 G Ethernet, NeoPhotonics announced new CWDM and DWDM options in its XFP pluggable transceiver line.

NeoPhotonics’ (News - Alert) expanded XFP line is compliant with the XFP 10 Gigabit Small Form Factor Pluggable MSA Revision 4.5. This offers flexibility to designers in configuring their platforms for different network applications and carriers can offer more service connections also. This is possible owing to the transceivers physically separating the optical interface from the rest of the hardware.

NeoPhotonics’ CWDM XFP line encompasses 8 wavelengths and is also expandable to 16. It will be offered in ER (40 km reach) and ZR (80 km reach) options, said company sources. The DWDM line is available in ER and ZR versions also and will cover 40 ITU compatible wavelengths in the C-band.

According to a news release, the new XFP options will augment NeoPhotonics’ offerings of high-speed pluggable transceiver modules. The CWDM version is suitable for Metro platforms where transmission rates are migrating from 2.5 Gbps to 10 Gbps per wavelength. System designers will be able to replace legacy 300 pin transponders to pluggable XFP transceivers with the help of the DWDM version. This is expected to reduce space and thermal load on transport platforms.

“These new XFP options complement well our current portfolio of high speed transceivers, which are widely deployed in networks around the world, and help solidify our position as one of the leaders in standard MSA transceivers,” said Ferris Lipscomb, VP Marketing of NeoPhotonics, in the release.

“Our XFP transceiver line is designed to meet the stringent performance and reliability requirements of current metro and long-haul transport networks and builds on our experience in several segments of the optical components market. We leverage both our conventional manufacturing as well as our ‘PIC,’ or photonic integrated circuit capabilities, which embody our commitment to innovation and technology leadership in optical components,” added Lipscomb.

The company proposes to showcase its new line of XFP transceiver modules at the CIOE 2009 Conference and Exhibition in Shenzhen Convention Center this week and later at the European Conference and Exhibition on Optical Communication in Vienna.

NeoPhotonics Corporation develops and manufactures photonic integrated circuit (PIC) based components, modules and subsystems for telecommunications networks. Products manufactured by the company incorporates active semiconductor, passive PLC and MEMS multi-dimensional switching functions in a single product.