infoTECH Feature

October 11, 2013

EnSilica and Kili Develop FIPS-compliant Secure Processor IC

EnSilica (News - Alert) recently announced the development of the Kili 3.1 FIPS 140-2 Level 3 (Federal Information Processing Standard) compliant secure processor IC in collaboration with Canada-based Kili Technology Corporation. The Kili 3.1 secure processor IC has been designed to support payment, authentication and identity applications and production devices. 

The Kili 3.1 secure processor IC incorporates EnSilica’s high-performance and features its low-power 32-bit eSi-3250 soft processor core along with Kili Corporation’s dual processor framework. EnSilica also incorporated 1MB of embedded Flash, Smart Card reader, USB and NFC connectivity, I2C, UART, SPI, and SWP and TRNG.

Ian Lankshear (News - Alert), CEO of EnSilica said, “The development of the Kili 3.1 secure processor IC is another prime example of how a highly focused fabless semiconductor company can collaborate with us to help bring their ideas to silicon. As the Internet of Things starts to broaden and really take off, the Kili 3.1 secure processor IC provides a much needed, highly-integrated solution that delivers excellent security and connectivity features with significant potential savings on the bill of materials (BOM).”

Kili 3.1 can support principal cryptography protocol implementation which includes RSA (News - Alert), AES and DES, over a PC, laptop, tablet or smartphone. Featuring advanced security functions and mesh sensor, Kili 3.1 comes with active shield protection; voltage, temperature, clock and tamper detection; and a secure battery backup of key memory along with auto erase, encryption acceleration, and EMV L1/L2 firmware. All of these features and capabilities are available for both contact and contactless applications.

Afshin Rezayee, Founder and Co-President of Kili Technology Corporation said, “Licensing the eSi-3250 has provided us with real technical advantages compared to other CPU cores and outsourcing the processor sub-system development to EnSilica has helped reduce our IC development time. This has allowed us to focus on our product differentiation and the development of the IP specific to our end applications. The flexible multi-processor architecture has helped us develop novel security features to meet the all-important FIPS security certification. We will continue to use EnSilica’s eSi-RISC cores along with its front-end and physical design services to support our ongoing chip development activities.”




Edited by Stefania Viscusi
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