infoTECH Feature

October 09, 2012

Anritsu's Microwave Technology Center Offers Thin Film Fabrication Services

Recently, Anritsu (News - Alert) has revealed that its Microwave Technology Center (MTC Fab) provides thin film fabrication services to help companies optimize device performance and also bring products from first prototypes through the manufacturing process quickly and cost effectively.

MTC Fab combines two decades of operation with advanced technology to manufacture circuits for microwave applications, multi-layer systems (MCM-D) and thin film sensors. In addition, it also manufactures resistor networks, attenuator circuits, hybrid circuits, and power hybrids used in telecommunications, defense, automotive, civil aviation and space, biotechnology, medical, and calibration designs.

The center is equipped with a complete line of manufacturing and test equipment, which helps the company to fabricate a variety of thin film devices according to customers’ specifications.

MTC’s experienced staff and the equipment advance prototype CAD designs enable high-volume manufacturing in a short time. Partnering with customers, the company develops and refines the thin film device designs, achieving performance requirements.

“Our engineers have extensive experience with circuit processing technologies, and work closely with our customers’ designers to develop the optimal fabrication processes to achieve their circuit design,” said Donn Mulder, vice president and general manager of Microwave Measurements Division (MMD) at Anritsu, in a statement.

In addition, customers also benefit as fab equipment can support the high-mix circuit needs and devices can be fabricated on a variety of form factors, with thicknesses up to 125 mil. Moreover, devices can be made with various materials such as alumina, fused silica, silicon, glass and titanium.

Further, an ISO9001-certified quality assurance program has been instituted to ensure products meet customers’ requirements.

Anritsu offers customer-specific services such as thin film depositions, resistor laser trimming, substrate laser drilling, photolithography patterning, and device singulation services.

Edited by Jamie Epstein

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