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September 17, 2012

New MSA Industry Standard Reduces Pump Laser Packaging Form Factor by 70 Percent

Renowned optical communications and laser solutions providers, Oclaro and 3SPGroup, have introduced a new industry standard Small Form Factor (SFF) pump laser package, marking a significant advancement in pump laser packaging.

Based on Multi-Source (News - Alert) Agreement (MSA), the new 10-pin butterfly package will enable the customers to develop compact amplifiers with lower costs and reduced space requirement in network equipment. 

For the last 15 years, the standard for packaging has been based on a 14-pin format. This newly introduced 10-pin butterfly package is approximately 30 percent the size of the legacy 14-pin format package.

In a recent statement, Oclaro and 3SPGroup announced that as the driving forces behind the new 10-pin butterfly MSA standard, both would ensure that next-generation pump lasers meet a defined and agreed mechanical outline, footprint and electrical pin-out.  

This is extremely important to amplifier customers who would otherwise have to deal with many different formats and form factors from their pump vendors.

However, the new package has the same pin-out, pin-pitch and front mounting hole centers as the existing legacy 14-pin so that it remains backwardly compatible with legacy applications.

“Lower-cost and space-efficient optical amplification with potentially higher component density is critical to implementing complex network solutions,” said Simon Loten, director of Product Management at Oclaro, Inc. “Customers are looking for ways to reduce form factors and they also want to standardize on one format for all their needs – whether that be cooled and uncooled pump products or multi-chip devices. This new MSA represents a significant advancement in the pump laser industry and we are pleased to deliver this innovative new format to our customers so that they can differentiate in the market with smaller and lower cost designs.”

“This new product family complements our existing small size pump module offerings (MiniDIL),” said CTO at 3SPGroup, Didier Sauvage. “The industry is trending toward smaller form factors, and by establishing an MSA, customers now have a clear route and assurance that they will have multiple-vendor supply.”

Oclaro announced that it will be debuting new 100G products and technologies, and will speak on several industry panels at the upcoming ECOC Exhibition from Sept. 17-20 in Amsterdam, The Netherlands.

Want to learn more about the latest in communications and technology? Then be sure to attend ITEXPO West 2012, taking place Oct. 2-5, in Austin, TX. Stay in touch with everything happening at ITEXPO (News - Alert). Follow us on Twitter.




Edited by Braden Becker
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