MagnaChip Semiconductor Corporation has introduced a high voltage option for its 0.18um embedded EEPROM technology. This enhanced process increases noise immunity by improving upon signal-to-noise ratio (SNR), a critical issue in touch sensing IC performance.
Unwanted electrical noise can generate spurious signals creating false touches in the sensing circuitry. The company’s process technology enhances the functionality and performance of these IC designs by improving the signal-to-noise characteristics.
The company’s new 0.18um embedded EEPROM process was developed utilizing high-voltage capacitors and 20V transistors. This was done without compromising the existing 0.18um EEPROM and logic characteristics making the process highly suitable for touch sensing IC applications. Looking ahead, MagnaChip also intends to develop a 30V process which is suitable for larger screen mobile applications. Delivery is targeted for 2013.
Namkyu Park, VP of Foundry Marketing at MagnaChip, said, "We are very pleased to offer a high voltage option for our enhanced 0.18um embedded EEPROM technology. Our goal is to continue to develop competitive features that meet the increasing application specific needs of our foundry customers."
The latest trend in smartphone and tablet PC touch applications has been a move toward thinner designs. These smaller form factors often make the electronic circuitry more susceptible to internal and external electrical noise. The various sources of noise, particularly in mobile devices, include the close proximity of the various semiconductor components within the system, battery chargers and even external factors such as temperature and humidity.
MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications.
Recently, the company launched a Voice Coil Motor (VCM) driver IC (MAP1011) to support the autofocus function found in mobile phone and tablet PC cameras. The MAP1011 model features a 10-bit resolution enabling 1,024-level precision control while utilizing the I2C high-speed controller methodology. The MAP1011 VCM driver also uses wafer level chip scale packaging (WLCSP) enhancing low-power operation and reducing standby power consumption. In addition, WLCSP provides user flexibility allowing mobile phone and tablet PC camera module developers a broad choice of product options based only on input and standby voltage criteria.
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