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Murali Ramasubramanian, Enovix Co-founder and Vice President of R&D, to Present at 2019 International Battery Seminar
[March 20, 2019]

Murali Ramasubramanian, Enovix Co-founder and Vice President of R&D, to Present at 2019 International Battery Seminar


FREMONT, Calif., March 20, 2019 /PRNewswire/ -- Enovix will deliver the first public technical presentation of its 3D Silicon Lithium-ion Battery at the 2019 International Battery Seminar & Exhibit in Fort Lauderdale, Florida next week. Murali Ramasubramanian, PhD, Enovix co-founder and vice president of research and development, will deliver the presentation on Thursday, March 28, 2019, from 2:25 to 2:55 pm EDT, at the Fort Lauderdale Convention Center during the Innovation & Design in Next-Gen Consumer Electronics Applications section of the Battery Power for Consumer Electronics track.

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"To date, small amounts of silicon have been added to predominantly graphite anodes in conventional lithium-ion battery architecture, but this has increased energy density only about 5%," says Dr. Ramasubramanian. "Through innovative 3D cell architecture, Enovix has developed a lithium-ion battery that enable a high-capacity silicon anode to increase energy density by 30% to 80%, depending on cell size, while achieving a cycle life over 500."



Dr. Ramasubramanian will describe how Enovix patented 3D cell architecture contains silicon expansion within the cell core and maintains high cell-stack pressure to eliminate external swelling and silicon particle pulverization. He will also describe how orthogonal stacked design enables an efficient, scalable pre-lithiation process at cell level to overcome low-formation efficiency. And he will present test results that demonstrate cycle life over 500.

About Enovix


Enovix is building a next-generation lithium-ion battery to increase energy density and improve safety. Our patented 3D cell architecture enables a high-capacity silicon anode to increase energy density by 30% to 80%, depending on cell size. And our patented 3D cell architecture includes features that reduce the danger of thermal runaway. We're backed by strategic relationships with Intel, Qualcomm and Cypress and over $150 million in venture, strategic, and private funding. We've been awarded over 50 patents and have over 50 more pending that will create sustainable enterprise value and a competitive barrier for years to come. For more information, visit www.enovix.com.

 

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SOURCE Enovix Corporation


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