|[March 13, 2017]
QSFP-DD MSA Group Announces Form Factor Specification
The Quad Small Form Factor Pluggable Double Density (QSFP-DD) Multi
Source Agreement (MSA) group has released a specification for the new
QSFP-DD form factor. In total, 52 companies came together in support of
the QSFP-DD MSA to address the industry need for high-density,
high-speed networking solutions.
Established in March 2016, the QSFP-DD MSA group accepted the challenge
to meet the market demand for a next generation high-density, high-speed
pluggable module form factor. The MSA group has succeeded in releasing a
specification with broad market support that overcomes the technical
challenges of specifying a QSFP28 compatible double-density interface.
The QSFP-DD specification defines mechanical, electrical and thermal
management requirements to enable multi-vendor interoperability.
QSFP-DD pluggable modules can quadruple the bandwidth of networking
equipment to keep pace with advances in ASIC technology. Systems
designed for QSFP-DD modules will be backwards compatible with existing
QSFP form factors and provide maximum flexibility for end users, network
platform designers and integrators.
The QSFP-DD specification defines a module and both a stacked height
integrated cage/connector system and a single height cage/connector
system. These expand on the QSFP form factor, the industry's leading
multi-lane pluggable form factor used across Ethernet, Fibre Channel and
InfiniBand for 40 Gbps and 100 Gbps network applications.
The new QSFP-DD frm factor expands the standard QSFP four-lane
interface by adding a row of contacts providing for an eight-lane
electrical interface, each operating up to 25 Gbps with
Non-Return-to-Zero (NRZ) modulation or 50 Gbps with Pulse (News - Alert) Amplitude
Modulation (PAM4). This adaptation allows the QSFP-DD form factor to
address solutions up to 400 Gbps aggregate per QSFP-DD port, while
providing backward compatibility to 40 Gbps and 100 Gbps. A single
switch slot can support up to 36 QSFP-DD modules providing up to 14.4
Tbps aggregate capacity. With an advanced thermal design, the new
QSFP-DD solution can support modules up to 12W, providing significant
system design flexibility.
QSFP-DD MSA founder-promoters include Broadcom (News - Alert), Brocade, Cisco, Corning,
Finisar, Foxconn Interconnect Technology, Huawei, Intel, Juniper
Networks, Lumentum, Luxtera, Mellanox Technologies, Molex (News - Alert), Oclaro, and
Contributors include Amphenol, Applied Optoelectronics, APRESIA Systems,
Celestica, Ciena, ColorChip, Dell EMC, Delta, Fujitsu (News - Alert) Optical
Components, Genesis, H3C, Innovium, Inphi, Ixia, Kaiam, LEONI, Lorom,
Luxshare, MACOM, MaxLinear, MultiLane, NeoPhotonics, Nokia, Panduit,
PHY-SI, Ranovus, Samtec, Senko, Semtech, Sicoya, Siemon, Skorpios
Technologies, Source Photonics, Spirent, Sumitomo Electric, Xilinx, and
Yamaichi (News - Alert) Electronics.
The QSFP-DD form factor specification is available for free download at
the QSFP-DD MSA website www.qsfp-dd.com.
Caution Concerning Forward-Looking Statements
We are disclosing forward-looking information so that investors,
potential investors, and other owners can better understand the
mentioned Companies' future prospects and make informed investment
decisions. The information in this press release contains
"forward-looking statements" within the meaning of the Private
Securities Litigation Reform Act of 1995. These statements can be
identified by the fact that they do not relate strictly to historical or
current facts. Any forward-looking statement made by the Companies speak
only as of the date on which it is made. The Companies are under no
obligation to, and expressly disclaim any obligation to, update or alter
their forward-looking statements, whether as a result of new
information, subsequent events or otherwise.
View source version on businesswire.com: http://www.businesswire.com/news/home/20170313005830/en/
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