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Molex Spotlights High-Speed Data Connectivity and Expertise at DesignCon 2017Molex, a global provider of integrated electronic products, will showcase high-speed data connectivity solutions at DesignCon 2017 in Santa Clara, CA, February 1-2, 2017. Molex (News - Alert) booth 619 will feature next-generation technologies designed to meet rising data speeds and bandwidth in demanding networking and high performance computing applications. "As more data is generated and infrastructure moves to the cloud, next-generation I/O and cabling solutions support faster processing, more bandwidth, increased density and thermal management-while maximizing data flow efficiency and reliability in today's datacenters," said Jairo Guerrero, director of product marketing, Molex. At DesignCon 2017, Molex will display the new Quad Small Form Factor Pluggable Double Density (QSFP-DD) System for high-density, high-speed networking. The eight-lane electrical interface operates up to 25 Gbps NRZ modulation or 50 Gbps PAM4-allowing solutions up to 200 Gbps NRZ or 400 Gbps PAM4 aggregate per QSFP-DD port. Other Molex demo and solutions on display will include:
Optimization Methods for High Speed SerDes Channels Using Com Metric: Demand for higher bandwidth has greatly increased the signaling data rates for SerDes. Cost-effective implementation of these high bandwidth channels across high volume manufactured products requires analysis of numerous parameters. The technical session will explore the unique design and manufacturing challenges, and various optimization methods. Performance Analysis of Interconnects for 112 Gbps PAM4 Data Rates: At high-speed data rates, small imperfections in communication channels contribute significantly to impedance mismatch, transmission resonances, crosstalk, and mode conversion. This technical session will discuss the adverse effects on overall data rate performance, performance limitations and present methods to optimize 112 Gbps data rate with PAM4 modulations. For more information about next-generation high-speed connectivity, please visit the Molex booth at DesignCon 2017 or www.molex.com/designcon2017. About Molex: Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, medical, industrial, automotive, and commercial vehicle. For more information, please visit www.molex.com. Molex Resources:
Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other jurisdictions.
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