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Orbotech Enters Solder Mask Direct Imaging Segment with a New Family of Direct Imaging SolutionsYAVNE, Israel, November 5, 2015 /PRNewswire/ -- ORBOTECH LTD. (NASDAQ: ORBK), a leading provider of process innovation technologies, solutions and equipment serving the global electronics manufacturing industry, today announced the introduction of a new family of Direct Imaging (DI) solutions for Printed Circuit Board (PCB) solder masks. Direct Imaging, one of the methods utilized in imaging solder mask layers, is an increasingly important segment, which Orbotech currently estimates to between $70M - $90M per annum. Orbotech's new solutions, which include the Orbotech Diamond™ and the Nuvogo™ 1000, are expected to accelerate and increase the overall quality and efficiency of PCB solder mask production processes. The Orbotech Diamond DI system addresses the solder mask manufacturing needs of the High Density Interconnect (HDI) and Multilayer board (MLB) segments of the PCB industry by offering high power and throughput. Beta site testing by three different customers in diverse geographical regions has resulted in orders from all three PCB manufacturers. The Orbotech Nuvogo 1000 joins the field proven Nuvogo family of products and brings high accuracy and industry leading Depth of Focus (DoF) to flexible PCB solder mask and other precision applications. "With the demand for smaller, sleeker and wearable electronics, today's manufacturers require PCB flexible production solutions that enable them to produce compact, high-quality and low-cost PCBs with multiple competitive features in quick turnaround conditions" said Mr. Arik Gordon, Corporate Vice President and President of the PCB Division at Orbotech Ltd. "Our new solder mask DI systems offer PCB manufacturers effective tools that deliver high throughput and streamlined production by enabling a unified workflow and a consistent user interface from patterning to solder mask, advancing the quality of PCB volume production and ultimately increasing overall production yield." Orbotech Solder Mask DI Solutions Orbotech's DI systems are specially designed to handle the most challenging PCB production applications. Most of the world's high-end PCBs used in smartphones are already produced using Orbotech systems; and the new products announced today will introduce even greater functionality to Orbotech's portfolio of DI systems. Throughput enhancement features include a dual table mechanism for imaging speed optimization and flexible scaling modes to ensure exceptional registration. Orbotech Diamond DI Solution
Nuvogo 1000 DI Solution
About Orbotech Ltd. Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world's most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Virtually every electronic device in the world is produced using Orbotech systems. For more information, visit http://www.orbotech.com/. Cautionary Statement Regarding Forward-Looking Statements Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words "anticipate," "believe," "could," "will," "plan," "expect" and "would" and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements. These forward-looking statements are made based on management's expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to Orbotech's operations and business environment, all of which are difficult to predict and many of which are beyond the Company's control. Many factors could cause the actual results to differ materially from those projected including, without limitation, timing and extent of achieving the anticipated benefits of the acquisition of SPTS; Orbotech's ability to effectively integrate and operate SPTS's business, the timing, terms and success of any strategic or other transaction, cyclicality in the industries in which the Company operates, the Company's production capacity, timing and occurrence of product acceptance (the Company defines 'bookings' and 'backlog' as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and each of its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smartphones, tablets and other electronic devices, the timing for a verdict in the ongoing appeal of the criminal matter and ongoing investigation in Korea, the final outcome and impact of this matter, including its impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company's customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, ongoing or increased hostilities in Israel and other risks detailed in the Company's SEC reports, including the Company's Annual Report on Form 20-F for the year ended December 31, 2014, and subsequent SEC filings. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law. COMPANY CONTACTS: SOURCE Orbotech Ltd. 
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