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Microsemi Announces Availability of First Device in New Family of Smart Inductor Sensor Interface ICsALISO VIEJO, Calif., July 30, 2015 /PRNewswire/ --Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of the first device in its new family of sensor interface integrated circuits (ICs) based upon inductive sensing technology. The LX3301A, the first inductive sensor IC in the market utilizing linear variable differential transformer (LVDT) architecture implementations on printed circuit boards (PCB), is designed for applications within the automotive and industrial markets.  Sensors are a key element in the feedback loop of virtually all closed-loop systems. With Microsemi's inductive sensing technology, the LX3301A sensor interface IC features LVDT principles, resulting in superior immunity to noise and interference. Microsemi's technology can also replace the incumbent Hall-effect sensors currently utilized in the marketplace, as these magnet-based sensors are susceptible to external magnetic fields and/or metal objects in close proximity. Inductive technology eliminates the magnet, thereby improving immunity to such interference. "Microsemi is a market leader in inductive sensing technology, having supplied customized ICs in production for more than five years, and we are excited to expand our market opportunities with the LX3301A," said Shafy Eltoukhy, vice president and business unit manager at Microsemi. "Inductive sensing is an emerging technology which can replace Hall-effect sensing in a wide variety of mechanical motion sensing applications, and provides significant improvement in temperature stability, enhanced reliability and safety, and reduced system costs for our customers." The new device is ideal for a variety of applications related to control systems and industrial automation, specifically linear displacement measurement (fluid level sensing, gear position for transmission actuator position and brake lamp switch/proximity detection) and angular motion measurement (robotic arm position, rotating shaft position, pedal position and rotary controls). It also meets strict automotive application requirements, including AECQ100-certified grade 1, ISO26262 compliance and production part approval process (PPAP) documentation support. Additional features include:
The implementation of sensors continues to expand throughout the automotive and industrial markets. For example, according to MEMS Journal
The LX33xx sensor IC family can be used with Microsemi's motor drive reference design utilizing the SmartFusion®2 system-on chip (SoC) field programmable gate array (FPGA) and a motor control IP suite to process the sensor inputs and motor drive algorithms. The sensor inputs can be connected to the motor control evaluation board. For information, visit http://www.microsemi.com/applications/motor-control. Availability About Microsemi's Automotive and Industrial Portfolio About Microsemi Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners. "Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to the first device in its new family of standard product sensor interface ICs based upon inductive sensing technology, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances. Logo - http://photos.prnewswire.com/prnh/20110909/MM66070LOGO
To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/microsemi-announces-availability-of-first-device-in-new-family-of-smart-inductor-sensor-interface-ics-300121036.html SOURCE Microsemi Corporation 
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