Fujitsu to Showcase Its Innovative, Industry-leading Products and Technologies for Security and Surveillance Systems at Exposec International Security Fair in Sao Paulo

SUNNYVALE, Calif., April 30, 2015 /PRNewswire/ -- Fujitsu Semiconductor America (FSA) will showcase its latest ferroelectric random access memory (FRAM) ICs at the XVIII annual Exposec International Security Fair in Sao Paulo May 12-14.

At booth 819A, Fujitsu, the representative of Socionext Inc., will also feature Socionext's "IdeaBoxx™" graphics application development kit, which is designed for industrial applications. The company also will show the world's first 360-degree wrap-around video imaging for security, surveillance, and situational awareness.

FRAM Features High Endurance while Conserving Power

FRAM is the latest generation of non-volatile memory that outperforms memories like E2PROM and Flash, consumes less power, and offers higher speed and endurance to multiple read-and-write operations. FRAM is non-volatile, but operates in other respects like RAM. This breakthrough storage medium is used in a variety of applications including data logging, smart cards, RFID, security, metering equipment, medical and other applications that require high-performance non-volatile memory. For details visit http://www.fujitsu.com/us/products/devices/semiconductor/memory/

IdeaBoxx™ Graphics Application Developers' Kit Brings Users Up in Minutes

The Jade Ideaboxx is a quick start development tool featuring Socionext's Jade graphics display controller (GDC) .Based on an ARM™ 926EJES processor running at 333MHz, Jade has a fixed pipeline 3D graphics engine powerful enough to produce sharp, crisp graphics on screen sizes up to 1024 x 768. Jade can support two screens independently, along with dual video capture ports, and can apply video images to 3D meshes via texture mapping.This combination of features makes Jade ideal for many industrial and medical applications where screen sizes of 4 to 10 inches are common, providing designers, programmers and hobbyists with a low cost, self-contained, self-starting kit for prototyping and proof of concept projects. For more details visit http://www.fujitsu.com/us/products/devices/semiconductor/gdc/ideaboxx/

360-degree Wraparound View Technology Delivers a True 3-D Hemispheric View of a Building's Surroundings

The 360-degree Wrap-Around Video Imaging Technology uses a highly integrated SoC and advanced 3D algorithms to synthesize images from several cameras, recreating a seamless, 3D omnidirectional view of the area around a building. The SoC's video-processing technology can show any perspective and any sightline, and instantaneously and smoothly transition from one view to another. The technology is unique in its ability to offer a dynamically definable perspective or "free eye point," which enables system designers to select the perspective that provides the viewer with detailed information.  Originally developed for vehicle applications, the Wrap-Around Video Imaging Technology is ideal for security and surveillance systems. For more details visit http://www.fujitsu.com/us/products/devices/semiconductor/gdc/products/omni.html

For more information about Exposec in Brazil, visit http://www.exposec.tmp.br

About Fujitsu Semiconductor America, Inc.

Fujitsu Semiconductor America, Inc. (FSA) is a system memory group that is focused on high quality, high performance ferroelectric random access memory (FRAM), and wafer foundry with technology, support, and the sales business of Fujitsu Electronics. FSA provides highly reliable, optimal products and support to meet the varying needs of its customers throughout North and South America.

Visit the company's website at http://us.fujitsu.com/semi, e-mail [email protected] or call 1-800-866-8608. For company news and updates, connect with FSA on Twitter (http://twitter.com/FujitsuSemiUS), Facebook (https://www.facebook.com/FujitsuSemiconductorAmerica), or YouTube (http://www.youtube.com/FujitsuSemiUS). 

Company and product names mentioned herein are trademarks or registered trademarks of their respective companies. Information provided in this press release is accurate at time of publication and subject to change without advance notice.

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SOURCE Fujitsu Semiconductor America, Inc.

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