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Microsemi to Present at Stifel Technology, Internet & Media Conference and Goldman Sachs Technology & Internet Conference
[February 03, 2015]

Microsemi to Present at Stifel Technology, Internet & Media Conference and Goldman Sachs Technology & Internet Conference


ALISO VIEJO, Calif., Feb. 3, 2015 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, will present at the Stifel Technology, Internet & Media Conference at the Westin St. Francis in San Francisco on Feb. 9 at 10:55 a.m. PST, as well as at the Goldman Sachs Technology & Internet Conference at the Palace Hotel in San Francisco on Feb. 11 at 2 p.m. PST.

Microsemi Corporation.

Those unable to attend the Stifel presentation in person can access a live webcast in the Investors section of Microsemi's website, a rel="nofollow" href="http://www.microsemi.com/" target="_blank" rel="nofollow">www.microsemi.com. The Stifel webcast will be hosted on the site for 90 days.



About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com.

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To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/microsemi-to-present-at-stifel-technology-internet--media-conference-and-goldman-sachs-technology--internet-conference-300029260.html

SOURCE Microsemi Corporation


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