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Winbond Electronics Corporations in electronica 2014(ENP Newswire Via Acquire Media NewsEdge) ENP Newswire - 17 October 2014 Release date- 16102014 - Winbond Electronics Corporation is attending the upcoming electronica 2014, 26th international trade fair in Munich, Germany. Come to visit us to learn more about Winbond's memory solutions for Automotive, Industrial and Internet of Things. For more information about the electronica 2014, please visit: http://www.electronica.de/en/home (Booth No: A6.570/3) About Winbond Winbond Electronics Corporation is a worldwide leading supplier of specialty memory IC's. The company provides memory solution backed by the expert capabilities of design, manufacturing and sales services. Winbond's product portfolio, consisting of Mobile DRAM, Specialty DRAM and Code Storage Flash, is widely used by tier-1 customers in consumer, communication, computer peripheral and automotive markets. Our 300 mm wafer fab keeps pace with advanced process technologies to provide high-quality memory IC products. The Company was established in September 1987 and listed on Taiwan Stock Exchange in 1995 with headquarter in Central Taiwan Science Park, Taichung, Taiwan. Winbond also has subsidiaries in China, Hong Kong, Israel, Japan and the US. For more information, please visit: www.winbond.com Contact: Jenny Chen Tel: 886-3-5678168 #86333 Email: [email protected] (c) 2014 Electronic News Publishing - |