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TMCNet:  63Mbps in 3C-HSDPA Test by Huawei

[August 13, 2014]

63Mbps in 3C-HSDPA Test by Huawei

(ENP Newswire Via Acquire Media NewsEdge) ENP Newswire - 13 August 2014 Release date- 12082014 - Shenzhen, China - Huawei, a leading global information and communications technology (ICT) solutions provider, today announced that it has successfully completed tests of 3-Carrier-High Speed Downlink Packet Access (3C-HSDPA).

The trial achieved peak download rates of 63Mb/s, a 50% increase in downlink user speeds compared with Dual Carrier-High Speed Downlink Packet Access (DC-HSDPA). Huawei believes when commercially available in the coming years, the technology could benefit billions of mobile data users on UMTS networks worldwide.

'This is a timely and important milestone in a fast expanding world of smart phones, growing mobile video demand and real-time large file download expectations,' said Wang Yixiang, President of UMTS Domain in Huawei. 'The relevance of higher speed downlink is also of significance for a growing number of multi-carrier networks, especially 3G 900 MHz and 2100 MHz band network deployments where improving download speeds through multi-carrier aggregation technology is critical for maintaining user experience and retention.' Universal Mobile Telecommunications System (UMTS) are the most widely deployed mobile broadband (MBB) networks worldwide. Carrier aggregation technology continues to enhance the user experience and ensures 3G will remain a viable alternative to 4G networks as they get rolled out progressively over time.

Release10 of 3GPP introduces 3C-HSDPA technology, effectively aggregating three carriers for a single downlink subscriber over one or two mainstream UMTS bands at 850-900MHz and 2100MHz. Bringing superior service experiences for mobile broadband users and significantly boosting multi-carrier aggregation efficiency, this technology also improves the efficiency of wireless spectrum usage. The recent tests made use of the latest version of Huawei's access network equipment and the Qualcomm Snapdragon 801 processor, a product of Qualcomm Technologies, Inc. Huawei and Qualcomm Technologies, a wholly-owned subsidiary of Qualcomm Incorporated, successfully completed a joint test of DC-HSUPA (Double Carrier High-Speed Uplink Packet Access) in 2013. Working together to maximize spectrum efficiency and improve user experiences remains a constant objective for both mobile industry chain collaborators to create the comprehensive UMTS multi-carrier establishment over the next three to five years. The eventual net results are forecast to be to the benefit of billions of UMTS subscribers worldwide.

Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. All Qualcomm Incorporated trademarks are used with permission (c) 2014 Electronic News Publishing -

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