|[May 13, 2014]
eASIC Announces Support for GigaChip Interface
SANTA CLARA, Calif. --(Business Wire)--
eASIC Corporation, a leading provider of Single Mask Adaptable ASIC™
devices and MoSys,
Inc., a leader in semiconductor solutions that enable fast,
intelligent data access for network and communications systems, today
announced successful hardware interoperability at 10.3125Gbps and
12.5Gbps between the MGIO (Multi Gigabit I/O) serial transceivers on
eASIC's Nextreme-3 28nm family and the CEI-11 compatible interface on
the MoSys (News - Alert)® Bandwidth
eASIC® Nextreme-3 28nm product contains up to 52 high speed 12.5Gbps
transceivers and up to 18M equivalent gates. The MGIO transceivers
feature advanced transmitter and receiver equalization capabilities
coupled with low power consumption making them ideal for a wide variety
of systems in networking, computing, and storage applications. The GigaChipTM
Interface consumes less than 3% of the eASIC Nextreme-3 N3XT1800
The GigaChip Interface (GCI (News - Alert)) is a scalable, high-performance, serial
protocol for chip-to-chip communications that delivers system-level
benefits of reduced power, cost and complexity. Current implementations
built with compatible CEI-11G or XFI SerDes electrical transport
standards deliver up to 180Gbps of full duplex throughput using 16
SerDes lanes when running at a 12.5Gbps rate. A key differentiator for
the GCI protocol is hightransport efficiency, even for small payloads,
which makes GCI ideal for co-processor, memory, or multi-chip
communication. The interface also includes CRC error detection and
automatic error recovery provisions to meet the high-reliability
requirements of enterprise, service provider, and mission critical
communications and compute applications.
GCI is an open, royalty-free, interface specification originally
designed by MoSys for use with the Bandwidth (News - Alert) Engine family of ICs and is
suitable for any chip-to-chip interconnect.
"We are seeing a major trend towards high speed serial chip-to-chip
interconnect which is driven by the system requirements for 40G, 100G
and beyond," said Jasbinder Bhoot, vice president of worldwide marketing
at eASIC. "The combination of our ability to deliver high performance,
low NRE and fast-time to market ASIC devices and the GigaChip Interface
benefits of reduced complexity, power and cost, solves the system memory
bandwidth limitations in 100G+ carrier-class and enterprise equipment."
"eASIC is a leader in single mask ASICs and we are pleased to have its
support of the GigaChip Interface for its networking customers," said John
Monson, VP of marketing and sales for MoSys. "Leveraging the
GigaChip Interface with the Bandwidth Engine accelerated memory access
and offload capabilities combined with the eASIC Nextreme-3 arrays, our
mutual customers will be able to deliver differentiated high performance
networking solutions in less time, using less space and at lower cost."
About MoSys, Inc.
MoSys, Inc. (NASDAQ: MOSY) is a fabless semiconductor company enabling
leading equipment manufacturers in the networking and communications
systems markets to address the continual increase in Internet users,
data and services. The company's solutions deliver data path
connectivity, speed and intelligence while eliminating data access
bottlenecks on line cards and systems scaling from 100G to
multi-terabits per second. Engineered and built for high-reliability
carrier and enterprise applications, MoSys'�Bandwidth Engine® and
LineSpeed™ IC product families are based on the company's patented
high-performance, high-density intelligent access and high-speed serial
interface technology, and utilize the company's highly efficient
GigaChip™ Interface.�MoSys�is headquartered in�Santa Clara, California.
More information is available at�www.mosys.com.
Bandwidth Engine and�MoSys�are registered trademarks of�MoSys, Inc.�in
the US and/or other countries. GigaChip and LineSpeed are trademarks
of�MoSys, Inc.�All other marks mentioned herein are the property of
their respective owners.
eASIC is a fabless semiconductor company offering breakthrough Single
Mask Adaptable ASIC devices aimed at dramatically reducing the overall
cost and time-to-production of customized semiconductor devices.
Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs
are enabled through patented technology utilizing Via-layer customizable
routing. This innovative fabric allows eASIC to offer a new generation
of ASICs with significantly lower up-front costs than traditional ASICs.
Privately held eASIC Corporation is headquartered in Santa Clara,
California. Investors include Khosla Ventures, Kleiner Perkins Caufield
and Byers (KPCB), Crescendo Ventures, Seagate (News - Alert) Technology and Evergreen
Partners. For more information on eASIC please visit www.easic.com.
[ InfoTech Spotlight's Homepage ]