|[April 01, 2014]
Intel CEO Outlines New Computing Opportunities, Investments and Collaborations With Burgeoning China Technology Ecosystem
SHENZHEN, China --(Business Wire)--
INTEL DEVELOPER FORUM - As the computing industry landscape undergoes
rapid transformation, Intel Corporation CEO Brian
Krzanich today outlined the company's plans to build upon its nearly
30-year history in China, and collaborate with the growing technology
ecosystem, particularly in Shenzhen, to accelerate new innovation and
reshape the computing industry.
The Intel(R) Gateway (News - Alert) Solutions for Internet of Things (IoT) based on the Intel(R) Quark processor. (Photo: Business Wire)
During his keynote, Krzanich discussed how Intel and the Shenzhen
technology ecosystem can re-ignite growth - both locally and globally -
and deliver differentiated computing products and experiences, spanning
multiple market segments, operating systems and price points.
Underscoring this point, he announced the establishment of an Intel
Smart Device Innovation Center in Shenzhen and a US$100 million Intel
Capital China Smart Device Innovation Fund.
Intel's CEO also detailed several new products and technologies the
company will begin offering this year, including Intel® Edison, a
product-ready, general-purpose computing platform first imagined in the
company's research labs in China. He also announced availability of the
Intel® Gateway Solutions for the Internet of Things (IoT) based on Intel
Quark™ and Atom™ processors, and demonstrated for the first time SoFIA,
Intel's first integrated mobile SoC platform for entry and value
smartphones and tablets.
Krzanich was joined at the opening day of its annual developer forum by Ian
Yang, president of Intel China, who kicked off the conference, and Diane
Bryant, senior vice president and general manager of Intel's Data
Center Group, whose keynote outlined Intel's data center technologies as
the foundation of modern computing and emerging business opportunities
presented by the growth of smart, connected devices.
"The China technology ecosystem will be instrumental in the
transformation of computing," said Krzanich. "To help drive global
innovation, Intel will stay focused on delivering leadership products
and technologies that not only allow our partners to rapidly innovate,
but also deliver on the promise that 'if it computes, it does it best
with Intel' - from the edge device to the cloud, and everything in
Investing in Innovation in China
Building on the company's history of enabling and collaborating with
customers to deliver innovative platforms, Intel will establish the
Intel Smart Device Innovation Center in Shenzhen to accelerate the
delivery of Intel technology-based devices to the China market and
The center will expand Intel's work beyond tablets and provide local
OEMs, ODMs, and software developers with access to Intel technology
platforms and enabling support, including master reference designs for
turnkey solutions, development tools, supply cain sourcing, quality
management and customer support - acting as a bridge between product
conception and commercial deployment.
Further accelerating this effort, Krzanich announced the US$100 million
Intel Capital China Smart Device Innovation Fund focused on accelerating
innovation of smart devices, including 2 in 1s, tablets, smartphones,
wearables, IoT and other related technologies in China. The new
investment reinforces Intel Capital's commitment to the China IT
industry and ecosystem development. Since 1998, Intel Capital has
invested more than US$670 million in 110 companies in China across two
already-established investment funds.
Velocity in Mobile Devices
As 4G LTE (News - Alert) service expands in China, Intel is well-positioned to provide
a growing share of LTE chipsets. Intel's 2014 LTE platform, the Intel®
XMM™ 7260, meets the five-mode requirement of China Mobile (News - Alert)* today,
including support for TD-LTE, and TD-SCDMA protocols required in China.
Intel is actively engaged in China for certification of the XMM 7260,
paving the way for commercial availability in the second half of 2014
for performance and mainstream device market segments. Krzanich
demonstrated the Intel XMM 7260 by conducting the first public, live
call using China Mobile's TD-LTE network, and spoke to strong ecosystem
demand for a competitive LTE alternative.
Intel is also developing its SoFIA family of integrated mobile SoCs for
entry and value smartphones and tablets. Krzanich demonstrated the
family's first silicon, booting up the new integrated Intel® Atom™
platform just months after adding the product to its ultra-mobile
roadmap. He also noted the strategic opportunity these market segments
present for Intel and the China technology ecosystems. Intel's SoFIA 3G
platform is on track to ship to OEMs in the fourth-quarter of 2014.
Krzanich also said that Intel is on track to ship 40 million tablets
this year, and showcased a variety of innovative designs developed in
China by OEMs and ODMs.
Enabling the Growing Internet of Things
Intel is actively pursuing a range of solutions, from the edge device to
the cloud, to address the growing opportunities presented by IoT.
Krzanich announced availability of the Intel® Gateway Solutions for IoT,
an integrated solution based on Intel Quark™ and Atom™ processors, in
addition to an Intel® Galileo-based development platform. These
platforms will help businesses reduce costs and offer new services by
unlocking valuable data from legacy systems that traditionally haven't
had a means to communicate with each other and the cloud.
The first platforms integrate Wind River (News - Alert)* and McAfee software to help
accelerate time to market and will be available from the ecosystem this
quarter. Customers developing gateway solutions include Shaspa* for
energy and building automation, RocKontrol* for energy management,
TransWiseway* and Vnomics* for transportation, and Zebra Technologies (News - Alert)
Corp* for locating solutions in retail, healthcare and manufacturing.
Turning to other smart, connected devices that help make up the IoT,
Krzanich said Intel® Edison is on track for availability later this
The Intel Edison disclosure in January drove enthusiastic responses from
the pro maker and entrepreneurial communities as well as consumer
electronics and industrial IoT companies. Krzanich said Intel is extending
Intel® Edison to a family of development boards that will address a
broader range of market segments and customer needs.
The first Intel® Edison board will now include use of Intel's
leading-edge 22nm Silvermont microarchitecture in development of a dual
core Intel® Atom SoC, increased I/O capabilities and software support,
and a new, simplified industrial design.
Diane Bryant Keynote
During her keynote address, Bryant shared how Intel's data center
technologies are the foundation for modern computing, and that the
opportunity to collaborate and drive local and global innovation is just
getting started. As companies shift to the rapid delivery of digital
services, new demands are placed on the data center, creating
opportunities for new innovations from partners. The three key growth
areas in particular are the cloud, big data analytics and high
Bryant was joined by Xuefeng Yuan, director of the Guangzhou
Supercomputing Center to showcase how high performance computing
technologies are improving society and increasing economic growth. The
Milky Way 2 system has more than 54 petaflops of performance - about
twice the performance of the second largest system on the current TOP500
supercomputer list. Intel technology has enabled local companies to get
the massive system ready to start making important scientific
breakthroughs and new discoveries.
Intel also disclosed that the next-generation Intel® Xeon® processor
E5-2600 v3 product family based on the Haswell microarchitecture will be
in production in the second half of this year.
Day 2 IDF Preview
Fisher, vice president and general manager of Intel's Software and
Services Group, Hermann
Eul, vice president and general manager of Intel's Mobile and
Communications Group, and Kirk
Skaugen, senior vice president and general manager of Intel's PC
Client Group, will open the second day of IDF. Each will highlight
Intel's advancements in mobile hardware and software development across
Windows* and Android*, address the opportunities and collaboration Intel
sees in China and with the China technology ecosystem, and outline how
Intel works with customers to help them differentiate and take full
advantage of Intel's products and technologies.
Intel (NASDAQ: INTC) is a world leader in computing innovation. The
company designs and builds the essential technologies that serve as the
foundation for the world's computing devices. Additional information
about Intel is available at newsroom.intel.com
Intel and the Intel logo are trademarks of Intel Corporation in the
United States and other countries.
*Other names and brands may be claimed as the property of others.
Photos/Multimedia Gallery Available: http://www.businesswire.com/multimedia/home/20140401006547/en/
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