Global Semiconductor Spin Spray Processor Equipment Market 2014-2018: The Adoption of Semiconductor Spin Spray Processor Equipment Increasing
(M2 PressWIRE Via Acquire Media NewsEdge) Dublin - Research and Markets (http://www.researchandmarkets.com/research/ndfhz4/global) has announced the addition of the "Global Semiconductor Spin Spray Processor Equipment Market 2014-2018" report to their offering.
The analysts forecast the Global Semiconductor Spin Spray Processor Equipment market will grow at a CAGR of 2.31 percent over the period 2013-2018. One of the key factors contributing to this market growth is the increasing demand for the integration and miniaturization of semiconductor devices. The Global Semiconductor Spin Spray Processor Equipment market has also been witnessing the emergence of 3D ICs. However, the cyclic nature of the Semiconductor industry could pose a challenge to the growth of this market.
The key vendors dominating this space are Dainippon Screen Mfg. Co. Ltd., Lam Research Corp., SEMES Co. Ltd., and Tokyo Electron Ltd.
The other vendors mentioned in the report are Akrion Systems LLC, Applied Materials Inc., and Shibaura Mechatronics Corp.
Commenting on the report, an analyst from the team said: In the recent past, the market has witnessed the emergence of a new method of chip packaging known as 3D IC. 3D IC refers to the stacking of multiple chips onto a single stack, thereby occupying less space in the device. During their manufacturing process, 3D ICs undergo numerous processes such as film deposition, etching, annealing, and cleaning. These steps are also repeated in a normal semiconductor process, but the number of steps increases significantly with the transition of circuits to a more complex 3D architecture. With the increase in the number of steps, the probability of cross-contamination during various manufacturing processes increases. Therefore, to remove undesired materials from the surfaces of wafers or components, semiconductor spin spray processor equipment is required. Hence, the emergence of this new type of chip packaging is likely to provide semiconductor spin spray processor equipment manufacturers with new business opportunities in the coming years, thereby propelling the growth of the Global Semiconductor Spin Spray Processor Equipment market.
For more information visit http://www.researchandmarkets.com/research/ndfhz4/global
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