|[March 04, 2014]
CALIENT Technologies Executives to Speak at OFC 2014 Conference
SANTA BARBARA, Calif. --(Business Wire)--
Technologies, Inc., the global leader for Optical Circuit Switching
(OCS) technology, today announced that two company executives will speak
as part of the OFC 2014 Conference, taking place March 9-13, 2014, at
the Moscone Center in San Francisco.
Atiq Raza, CALIENT chairman and CEO, will participate as part of the "OIDA
Photonics and SDN in the Data Center" panel on Sunday, March 9 at
4:00 p.m. Other panel members include Yuval Bachar of Facebook (News - Alert), Keren
Bergman of Columbia University and Mike Schlansker of HP.
CALIENT Vice President of Marketing, Daniel Tardent, will present "Hybrid
Packet OCS Connectivity in the Software Defined Data Center" at the
SDN Symposia on Wednesday, March 12 at 1:45 p.m.
"Atiq has more than 30 years of experience and will therefore bring a
very well-rounded perspective to the panel presentation," said Tardent.
"We're pleased at the opportunity to share our knowledge as well as
CALIENT's exciting new developments at this year's OFC."
Also at the exhibition, CALIENT is partnering to present a new software
controller that can monitor and move traffic flows between packet and
optical circuit switched fabrics in a data center working with the
company's S320 Optical Circuit Switch. The presentation will be in
CALIENT's booth #302. This solution will allow data center operators to
add 40Gbps and 100Gbps capacity at up to 10 times lower cost than pure
OFC is the largest global conference and exposition for optical
communications and networking professionals. For more information, visit http://www.ofcconference.org/.
About CALIENT Technologies
CALIENT Technologies is the global leader in pure photonic Optical
Circuit Switching with systems that enable dynamic optical-layer
optimization in next-generation datacenters and software defined
networks. CALIENT's 3D MEMS switches allow datacenter operators to
cost-effectively deploy 40 Gbit/s and 100 Gbit/s services at up to 10x
lower cost than conventional packet-based solutions. The company designs
and fabricates its systems using state of the art MEMS equipment in its
own fabrication facility located at its corporate headquarters in Santa
Barbara, California. For more information, visit us at http://www.calient.net,
or contact us at email@example.com.
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