|[March 02, 2014]
Toshiba Develops TransferJet(TM)-Compatible 3D-Integrated Ultra-Small Module and Ultra-Thin FPC Coupler
TOKYO --(Business Wire)--
(TOKYO:6502) has developed the world's smallest wireless communication
module and thinnest flexible printed circuit (FPC) coupler compatible
with TransferJetTM, the close-proximity wireless transfer
technology. In combination and applied to mobile devices, such as
smartphones, they achieve a maximum data transfer rate of 375Mbps.
Toshiba (News - Alert) demonstrated the devices on January 20 at 2014 IEEE Radio
Wireless Week (RWW), in Newport Beach, California, USA.
TransferJetTM continues to win attention as a low-power,
high-speed communication standard, and is expected to find wide
acceptance because of its uniquely simple approach to connectivity.
Since the already high data volumes handled by individuals are expected
increase explosively in the near future, TransferJetTM is a
highly promising solution for high-speed communications between
electronic devices in close proximity. This will fuel demand for
TransferJetTM, modules and couplers that can be easily
implemented in consumer products.
Toshiba's small module, only 4.8mm x 4.8mm x 1.0mm, and ultra-thin FPC
coupler, only 0.12mm thick, chieve a maximum physical layer
transmission rate of 522Mbps (effective data transfer rate of 375Mbps).
Module miniaturization was realized by employing 3D integration
technology to embed a TransferJetTM-compatible LSI in the
module substrate. Such embedding usually requires a higher module to
maintain performance, but Toshiba's advanced design capabilities enabled
it to secure a low module with excellent performance. The new thin FPC
coupler is fabricated with an innovative process that uses molecular
A potential problem with small, thin modules formed with 3D integration
technology is a parasitic capacitance increase that often degrades
performance. The frequency response of TransferJetTM is
particularly sensitive to this, as has a wide signal bandwidth, 560MHz.
Toshiba identified potential problems with parasitic capacitance, and
solved them with the design of the module structure and tuning
transmission signals' waveforms inside the LSI.
The new FPC coupler is fabricated with molecular bonding technology,
which secures enough adhesion of FPC by covalent bond of a thin
molecular layer. The coupler is electrically evaluated with the module
and excellent transmission RF signals have been observed. It has quarter
thickness of conventional couplers.
This module and coupler are ideal for small, thin mobile devices, and
Toshiba expects them to be widely adopted. The module is now ready for
sample production and the coupler will be ready for sample production
*: TransferJetTM is licensed by the TransferJet Consortium.
Toshiba is a world-leading diversified manufacturer, solutions provider
and marketer of advanced electronic and electrical products and systems.
Toshiba Group brings innovation and imagination to a wide range of
businesses: digital products, including LCD TVs, notebook PCs, retail
solutions and MFPs; electronic devices, including semiconductors,
storage products and materials; industrial and social infrastructure
systems, including power generation systems, smart community solutions,
medical systems and escalators & elevators; and home appliances.
Toshiba was founded in 1875, and today operates a global network of more
than 590 consolidated companies, with 206,000 employees worldwide and
annual sales surpassing 5.8 trillion yen (US$61 billion). Visit
Toshiba's web site at www.toshiba.co.jp/index.htm
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