|[January 20, 2014]
Research and Markets: Opportunities in the Supply Chain for High-Speed Electronics, 2012-2018
DUBLIN --(Business Wire)--
Research and Markets (http://www.researchandmarkets.com/research/ttlpzx/opportunities_in)
has announced the addition of the "Opportunities
in the Supply Chain for High-Speed Electronics, 2012-2018"
report to their offering.
A Strategic Review of PCB, Material and Interconnect on Trends and
Needs for Electronic Assemblies for High-Speed Telecom, Datacom Networks
and High-End Computers Over the Period 2012 to 2018.
The 2013 edition of this report as before explores the implications for
the next generation of high speed electronic architectures and the
supply chain as data rates shift up.
In network infrastructure, systems supporting 100G Ethernet are emerging
and serial transmission rates are more than doubling from 10Gbps to
>20Gbps. The next generation of standards will tackle 400G and the
solutions for this will require 40-50Gbps serial data. These and high
performance computing requirements, will be the factors which will drive
more widespread adoption of optical backplanes and silicon photonics
when signal integrity, interconnect density and thermal management
budgets cannot be realised with printed circuit boards.
In the wireless communication sector, the introduction and advancement
of 4G technology will have implications for base station and transceiver
design. New generations of eNodeB base stations are more compact in
size, more intelligent and more flexible in performance as base station
controllers are no longer required and an access network comprises
several base stations connected to each other and directly accessing a
gateway to the backbone network.
These and other applications are considered in the new High Speed Report
which includes technology roadmaps for high performance system
architectures, a detailed looked at the high performance laminates which
are available for the next generation of systems, and forecast of PCB
and laminate demand out to 2018.
Reasons To Buy
- This study provides a totally integrated assessment of the high speed
electronics value chain
- Identification and quantification of the opportunities for small,
medium and large technology vendors
- Comprehensive roadmaps detailing the technologies, materials and
processes that will be needed to participate in these markets
- Identifies key technology and market drivers of this major market
Key Topics Covered
High-Speed System Architecture And Market Drivers
Advanced Semiconductor (News - Alert) Packaging
Conclusion & Opportunities
For more information visit http://www.researchandmarkets.com/research/ttlpzx/opportunities_in
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