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TMCNet:  Intel Ends 2013 with a Bang; Industry Leading 22nm Mobile Apps Processor and a New Transistor, According to ABI Research

[December 18, 2013]

Intel Ends 2013 with a Bang; Industry Leading 22nm Mobile Apps Processor and a New Transistor, According to ABI Research

AUSTIN, Texas --(Business Wire)--

ABI Research (News - Alert) has verified that Intel has a leading position in the mobile processor technology race; launching the first 22nm mobile application processor. The 22nm quad-core application processor (Intel Z3740D) was found in a Dell (News - Alert) tablet that was recently launched for the Christmas season.

Core Transistor (Photo: Business Wire)

Core Transistor (Photo: Business Wire)

Jim Mielke, VP of engineering at ABI Research, comments, "2013 saw a number of new processor launches with 32nm and 28nm technology (most from fabless companies) but Intel (News - Alert) has used one of its core advantages (process technology) to pass them all." The 22nm process node used for the Z3740D is not just the smallest geometry in a mobile device today; it also introduces a new transistor. The core transistor structure used in the 22nm Z3740D is quite different than structures used in previous generations. The core transistor found in the device ABI Research analyzed (picture attached) has a gate that surrounds source/drain diffusion fins on three sides givig it the name tri-gate or 3D transistor.

The introduction of the 1.86GHz processor in a Dell product also hints to Dell renewing its commitment to the tablet market. Being first to introduce products with leading edge technology, like the Z3740D 22nm processor, is a good start for the company. Key sensors and interface devices found in the tablet included Knowles MEMS microphones, STM sensors and sensor hub, and Synaptics (News - Alert) touch screen controller.

These findings are part of ABI Research's Teardown Services (https://devices.abiresearch.com/). A complete teardown of the Dell Tablet with the Intel Z3740D and accompanying chips is available from ABI Research. The full teardown includes a complete bill of materials with cost estimates, high resolution dismantling and board photos, performance benchmarks, current drain measurements, a block diagram, component die photos and x-rays, and polysilicon photos of key devices.

ABI Research provides in-depth analysis and quantitative forecasting of trends in global connectivity and other emerging technologies. From offices in North America, Europe and Asia, ABI Research's worldwide team of experts advises thousands of decision makers through 70+ research and advisory services. Est. 1990. For more information visit www.abiresearch.com, or call +1.516.624.2500.


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