Toshiba Launches New Embedded NAND Flash Memory Modules Featuring 19nm Second Generation Process Technology
TOKYO and IRVINE, Calif., Oct. 30, 2013 /PRNewswire via COMTEX/ --
Toshiba Corporation and Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of its new embedded NAND flash memory modules. The new modules integrate NAND chips fabricated with Toshiba's 19nm second generation process technology and are fully compliant with the latest e-MMCTM standard. Designed for application in a wide range of digital consumer products, the new modules are targeted to smartphones, tablet PCs and digital video cameras.
Demand continues to grow for large density NAND flash memory chips that support high resolution video and deliver enhanced storage. This is particularly true in the area of embedded memories with a controller function, which minimize development requirements and ease integration into system designs. Toshiba is meeting this demand by reinforcing its line-up of high density memory products.
The company's new 32-gigabyte (GB) embedded device integrates four 64-Gigabit (equal to 8GB) NAND chips fabricated with Toshiba's cutting-edge 19nm second generation process technology and a dedicated controller into a small package measuring only 11.5 x 13 x 1.0mm. It is compliant with JEDEC e-MMC Version 5.0, published by JEDEC in September, and achieves a high read/write performance by applying the new HS400 high speed interface standard.
Toshiba's new line-up of single-package embedded NAND flash memories includes densities from 4GB to 128GB. Each device integrates a controller to manage basic control functions for NAND applications.
New Product Line-up
Product Name Capacity Package Mass Production
THGBMBG7D2KBAIL 16GB 153Ball FBGA End of November, 2013
THGBMBG8D4KBAIR 32GB 153Ball FBGA End of November, 2013
Mass production will begin at the end of November 2013, with additional densities (including 4GB, 8GB, 64GB and 128GB products) to follow.
-- The JEDECe-MMC V5.0 compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products.
-- Embedded in a system, the 128GB module can record up to 2,222 hours of music at a 128Kbps bit rate, 16.6 hours of full spec high definition video and 38.4 hours of standard definition video.
-- The new products apply NAND flash memory chips fabricated with Toshiba's leading-edge 19nm second generation process technology.
-- The new products are sealed in a small FBGA package measuring just 11.5 x 13mm, and have a signal layout compliant with the JEDECe-MMC V5.0.
Product Name THGBMBG8D4KBAIR THGBMBG7D2KBAIL
Interface JEDECe-MMC V5.0 standard
Capacity 32GB 16GB
Power Supply Voltage 2.7ï½3.6V (Memory core)
1.7Vï½1.95V / 2.7Vï½3.6V (Interface)
Bus Width x1 / x4 / x8
Write Speed 90MB per sec. 50MB per sec.
(Sequential/HS400 Mode) (Sequential/HS400 Mode)
Read Speed 270MB per sec. 270MB per sec.
(Sequential/HS400 Mode) (Sequential/HS400 Mode)
Temperature Range -25degrees to +85degees Celsius
Package 153Ball FBGA 153Ball FBGA
11.5 x 13 x 1.0mm 11.5 x 13 x 0.8mm
For additional company and product information, please visit http://www.toshiba.com/taec/ or http://www.toshiba.com/taec/adinfo/technologymoves.
*About Toshiba Corp. and TAEC
About TAEC Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's fifth largest semiconductor manufacturer (Gartner, 2012 Worldwide Semiconductor Revenue, April, 2013). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
For additional company and product information, please visit http://www.toshiba.com/taec/.
 e-MMC is a trademark and a product category for a class of embedded memory products built to the JEDEC e-MMC Standard specification. Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. Maximum read and write speed may vary depending on the host device, read and write conditions, and file size. For purposes of measuring read and write speed in this context, 1 megabyte or MB = 1,000,000 bytes. HD and SD are calculated at average bit rates of 17Mbps and 7Mbps, respectively. Read and write speed may vary depending on the read and write conditions, such as devices you use and file sizes you read and/or write. (For purposes of measuring data transfer and read-write speed in this context, 1 MB = 1,000,000 bytes).
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com, or from your TAEC representative.
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SOURCE Toshiba America Electronic Components, Inc.
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