|[February 27, 2013]
Violin Memory® Selects eASIC® for Flash Memory Arrays
SANTA CLARA, Calif. --(Business Wire)--
eASIC Corporation, a provider of NEW ASIC devices, today announced that
Violin Memory, provider of one of the world's fastest and most scalable
FLASH memory arrays, has selected eASIC's Nextreme-2T
NEW ASICs for implementing FLASH controllers for its latest 6000
Series enterprise-grade FLASH memory arrays.
Violin cites vastly superior power consumption and cost as the key
reasons for replacing high-density FPGAs with eASIC Nextreme-2T
devices within its FLASH storage arrays. In addition, the fast design
and turnaround time of Nextreme-2T
NEW ASICs enables Violin to ramp to high volume quickly and establish a
strong market lead in the fiercely competitive market for FLASH
memory-based enterprise storage appliances.
"We looked at a number of ASIC platform choices for implementing our
custom FLASH controllers," commented Kevin Rowett, vice president of
engineering for Violin Memory Inc. "We opted to collaborate with eASIC
for reducing cost and power consumption because their Nextreme-2T
NEW ASICs enabled us to quickly migrate from FPGAs, and inexpensively
ramp our solutions to high volume production," added Rowett.
"There is tremendous innovation going on in the enterprise storage
market and we are thrilled to be working with Violin, one of the fastest
growing leaders in this space," said Ronnie Vasishta, President and CEO,
eASIC Corporation. "OEMs need to continuously innovate and quickly ramp
to volume production. We are starting to see a tipping point where FPGAs
cannot be used in mission critical, power sensitive, volume applications
and the ASIC alternatives do not meet the requirements. Traditional
cell-based ASICs just take too long to design and ASSPs have limited
flexibility for the NAND FLASH interface," added Vasishta.
eASIC is a fabless semiconductor company offering breakthrough NEW ASIC
devices aimed at dramatically reducing the overall cost and
time-to-production of customized semiconductor devices. Low-cost,
high-performance and fast-turn ASIC and System-on-Chip designs are
enabled through patented technology utilizing Via-layer customizable
routing. This innovative fabric allows eASIC to offer a new generation
of ASICs with significantly lower up-front costs than traditional ASICs.
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