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TMCNet:  Tensilica: AM3D Audio Enhancement Ported to Tensilica's HiFi Audio DSPs; Targets Mobile Phones, In-car Entertainment, Home Entertainment Systems and PCs

[February 27, 2013]

Tensilica: AM3D Audio Enhancement Ported to Tensilica's HiFi Audio DSPs; Targets Mobile Phones, In-car Entertainment, Home Entertainment Systems and PCs

(M2 PressWIRE Via Acquire Media NewsEdge) SANTA CLARA, Calif. USA and AALBORG, Denmark -- Tensilica, Inc. and AM3D A/S today announced that the two companies have extended their partnership to port AM3Ds Audio Enhancement product to Tensilicas family of HiFi Audio DSPs. This will provide enhanced audio experiences for mobile phones, in-car entertainment, home entertainment systems and PCs.

AM3D Bass Enhancement and Transducer Equalization provide a highly noticeable boost to the audio performance and AM3D Virtual Surround Sound creates a profound sound image that extends beyond the physical loudspeakers. The solution is purely software-based and all features have very low memory footprint and CPU consumption.

A number of our customers have asked for superior audio enhancement solutions. AM3D offers magnificent audio enhancement with a natural timbre and an intense bass, and this optimized set of features will soon be available for our customers, stated Larry Przywara, Tensilicas senior director of mobile multimedia.

Tensilicas HiFi Audio/Voice DSP cores have become the favorite among many of our partners. We believe that our expanded relationship will make a difference in maintaining the successes for both AM3D and Tensilica, stated Jacob N. Andersen, senior vice president, AM3D A/S.

The complete port of AM3Ds Audio Enhancement software will be available in the second quarter of 2013.

About AM3D A/S AM3D A/S provides world-class audio technology. AM3D delivers software solutions for audio enhancement and 3D audio for mobile phones and other portable devices, in-car and home entertainment systems and for mission-critical applications. We hold several patents on audio technologies. Visit www.am3d.com.

About Tensilica Tensilica, Inc. is the leader in dataplane processor IP cores with over 200 licensees.

Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilicas automated design tools to meet specific and demanding signal processing performance targets. Tensilicas DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation.

For more information on Tensilicas patented, benchmark-proven DPUs visit www.tensilica.com.

Tensilica is a registered trademark belonging to Tensilica, Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.

Mobile World Congress Barcelona 25 28 February, 2013 Hall 6 Stand 6D101 Press Contacts: Paula Jones +1 (408) 327-7343 paula@tensilica.com Oliver Davies +44 1225 470 000 oliver.davies@publitek.com ((M2 Communications disclaims all liability for information provided within M2 PressWIRE. Data supplied by named party/parties. Further information on M2 PressWIRE can be obtained at http://www.presswire.net on the world wide web. Inquiries to info@m2.com)).

(c) 2013 M2 COMMUNICATIONS

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