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TMCNet:  Interlink Electronics and UCSB Announce Win-Win Partnership

[February 27, 2013]

Interlink Electronics and UCSB Announce Win-Win Partnership

CAMARILLO, Calif. --(Business Wire)--

Interlink (News - Alert) Electronics, Inc. (OTC: LINK) announced today its affiliation with UC Santa Barbara's Corporate Affiliates Program. Interlink's 28 years of expertise in advanced sensor technologies for Human/Machine interface applications and UCSB's portfolio of services such as research collaboration, technology licensing, and state-of-the-art R&D facilities represent a win-win partnership for advanced research and development initiatives.

Interlink Electronics, Inc. is the inventor of the Force Sensing Resistor® (FSR®) technology and is a technology pioneer in the printed electronics industry with over 30 patents issued or pending. FSR® devices are uniquely suited for a variety of applications such as force sensing, position sensing, and mouse & pointing applications, in a wide range of industries including medical, industrial automation, automotive, ruggedized equipment, robotics, and military systems.

Dr. Howard D. Goldberg, EVP of Corporate Business Development & Strategic Partnerships, commented: "Interlink's team understands that collaborating with the best engineers and scientists will accelerate innovation & technology development. This will allow us to continue to be at the leading edge and drive new business opportunities. Recognized as world leaders in materials science and micro-fabrication technologies, UCSB offers some of the newest and most comprehensively equipped R&D facilities in he world."

Mr. Steven N. Bronson, Interlink Electronics' Chief Executive Officer, said: "To successfully compete in today's High-Tech markets, the notion of having to do all R&D in-house is outdated thinking. The key to commercial success is leveraging expertise through collaborative R&D relationships in order to accelerate time-to-market and reduce R&D costs." Mr. Bronson added, "Interlink Electronics is proud to become a member of the Corporate Affiliates Program, whose membership includes such High-Tech industry leaders as Teledyne, Microsoft, Northrop Grumman, Corning (News - Alert), and Raytheon."

About Interlink Electronics, Inc.

Interlink Electronics, Inc. (OTC Markets: LINK) is a sensor technology company and one of the world's leading innovators of intuitive interface design. With numerous patents around the world protecting its technologies and products, Interlink Electronics serves a world-class customer base from its corporate headquarters in Camarillo, California, and offices in Japan, Hong Kong and China. For more information, see http://www.interlinkelectronics.com.

This release contains forward-looking statements that involve a number of risks and uncertainties. The following are among the factors that could cause actual results to differ materially from the forward-looking statements: historical losses and negative cash flow, the success of business divestitures and acquisitions, the ownership of the majority of our stock by a small group of investors, our success in predicting new markets and the acceptance of our new products, efficient management of our infrastructure, the pace of technological developments and industry standards evolution and their effect on our target product and market choices, the effect of outsourcing technology development, changes in the ordering patterns of our customers, a decrease in the quality and/or reliability of our products, protection of our proprietary intellectual property, competition by alternative sophisticated as well as generic products, pending litigation against Interlink, historical weaknesses in internal controls over financial accounting, the continued availability at competitive prices of raw materials for our products, disruptions in our manufacturing facilities, risks of international sales and operations including fluctuations in exchange rates, compliance with regulatory requirements applicable to our manufacturing operations, and customer concentrations. The forward-looking statements contained in this release should be considered in light of these risk factors.


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