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TMCNet:  AM3D Audio Enhancement Ported to Tensilica's HiFi Audio DSPs

[February 27, 2013]

AM3D Audio Enhancement Ported to Tensilica's HiFi Audio DSPs

(Marketwire Via Acquire Media NewsEdge) SANTA CLARA, CA and AALBORG, DENMARK -- (Marketwire) -- 02/27/13 -- Tensilica®, Inc. and AM3D A/S today announced that the two companies have extended their partnership to port AM3D's Audio Enhancement product to Tensilica's family of HiFi Audio DSPs. This will provide enhanced audio experiences for mobile phones, in-car entertainment, home entertainment systems and PCs.

AM3D Bass Enhancement and Transducer Equalization provide a highly noticeable boost to the audio performance and AM3D Virtual Surround Sound creates a profound sound image that extends beyond the physical loudspeakers. The solution is purely software-based and all features have very low memory footprint and CPU consumption.

"A number of our customers have asked for superior audio enhancement solutions. AM3D offers magnificent audio enhancement with a natural timbre and an intense bass, and this optimized set of features will soon be available for our customers," stated Larry Przywara, Tensilica's senior director of mobile multimedia.

"Tensilica's HiFi Audio/Voice DSP cores have become the favorite among many of our partners. We believe that our expanded relationship will make a difference in maintaining the successes for both AM3D and Tensilica," stated Jacob N. Andersen, senior vice president, AM3D A/S.

The complete port of AM3D's Audio Enhancement software will be available in the second quarter of 2013.

About AM3D A/SAM3D A/S provides world-class audio technology. AM3D delivers software solutions for audio enhancement and 3D audio for mobile phones and other portable devices, in-car and home entertainment systems and for mission-critical applications. We hold several patents on audio technologies. Visit www.am3d.com.

About TensilicaTensilica, Inc. is the leader in dataplane processor IP cores with over 200 licensees.

Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.

Tensilica is a registered trademark belonging to Tensilica, Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.

Add to Digg Bookmark with del.icio.us Add to Newsvine Press Contacts: Paula Jones (408) 327-7343 Email Contact Erika Powelson (831) 424-1811 Email Contact Jacob N. Andersen +45 9934 9835 Email Contact Source: Tensilica

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