Global 3D IC Market 2012-2016 Reveals That One of the Major Challenges Is the Thermal Conductivity Issues Associated With 3D ICs
(M2 PressWIRE Via Acquire Media NewsEdge) Dublin - Research and Markets (http://www.researchandmarkets.com/research/g6q449/global_3d_ic) has announced the addition of the "Global 3D IC Market 2012-2016" report to their offering.
TechNavio's analysts forecast the Global 3D IC market to grow at a CAGR of 19.7 percent over the period 2012-2016. One of the key factors contributing to this market growth is the huge demand for memory-enhanced applications. The Global 3D IC market has also been witnessing the increase of multi-chip packaging. However, the thermal conductivity issues could pose a challenge to the growth of this market.
The key vendors dominating this market space are Advanced Semiconductor Engineering Co. (ASE), Samsung Electronics Co. Ltd., STMicroelectronics N.V., and Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).
The other vendors mentioned in the report are Elpida Memory Inc., IBM Corp., Intel Corp., and Micron Technology Inc.
Commenting on the report, an analyst from TechNavio's Hardware team said: 'One of the emerging trends in the Global 3D integrated circuit (IC) market is multi-chip packaging. In this type of packaging more transistors can be packed into a single 3D IC. This type of packaging is very important for memory-enhanced applications because this approach enables improved interaction between the memory and the processor. It is expected that multi-chip packaging will be a promising approach for most applications in the future. Thus, vendors consider that multi-chip packaging is one of the crucial trends that will lead to the growth of the Global 3D IC market.'
According to the report, one of the major growth drivers is the increasing demand for 3D ICs in memory products (flash memory and DRAM). 3D ICs are able to improve the performance and reliability of memory products and can also help reduce their cost and size.
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