GLOBALFOUNDRIES and Rambus to develop semiconductor IP portfolio
Feb 12, 2013 (Datamonitor via COMTEX) --
GLOBALFOUNDRIES Inc., a semiconductor foundry, and Rambus Inc., a creator of semiconductor memory architectures, have unveiled plans to collaborate for the development of a portfolio of semiconductor intellectual property, or IP, optimized for GLOBALFOUNDRIES's process technology.
According to GLOBALFOUNDRIES, this collaboration will enable integration of Rambus' enhanced standard interface solutions into the next generation of electronics for faster time-to-market. These IP blocks will address the needs in applications ranging from high-performance computing to smart mobile devices.
Rambus will develop high-speed memory and chip-to-chip serial link interfaces optimized for GLOBALFOUNDRIES processes, including the new 14nm-XM technology, which is a 14nm offering based on a modular FinFET technology architecture. This new work will build on past collaboration on several 28nm test chips that demonstrate the capabilities of Rambus' interfaces for both mobile and server-based applications, GLOBALFOUNDRIES said.
"Our new foundry model of Collaborative Device Manufacturing (CDM) relies on early collaboration across the semiconductor ecosystem in order to deliver innovative solutions at the leading edge," said Mike Noonen, executive vice president of marketing, sales, design and quality at GLOBALFOUNDRIES. "This extension of our partnership with Rambus will give customers a faster path to take advantage of Rambus' advanced interface solutions on our new 14nm-XM technology, opening up new avenues for chip designers to innovate on our process technology."
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