Microsemi launches new SiGe RF front-end device
Nov 16, 2012 (Datamonitor via COMTEX) --
Microsemi Corporation, a provider of semiconductor solutions, has delivered the monolithic silicon germanium, or SiGe, RF front-end, or FE, device, the new LX5586 RF FE, for the 5th generation of Wi-Fi devices based on IEEE 802.11ac standard.
Benefitting from its integration levels and utilizing SiGe process technology, the new LX5586 RF FE provides performance and cost advantages over existing technologies. The RF FE is designed to be used in conjunction with Broadcom's BCM4335 combo chip for mobile platforms such as smartphones and tablets. BCM4335 is the first combo chip solution based on the IEEE 802.11ac standard, also known and deployed as 5G WiFi.
Microsemi LX5586's key technical features include; fully integrated, single chip 802.11ac 5GHz PA, LNA with bypass and SPDT antenna switch; small footprint of 2.5x2.5mm and only 0.4mm height; ultra linear power of 16dBm at 1.8 percent EVM, 256QAM modulation over 80MHz bandwidth; and high ESD protection of 1000V (HBM) on all pins.
"We're pleased to enter the 802.11ac market in collaboration with Broadcom," said Amir Asvadi, vice president and general manager at Microsemi. "The LX5586 is the smallest, most reliable, highest performance solution in the marketplace today and the first in a series of highly-integrated Wi-Fi subsystems we are introducing to our customers. This innovative front-end solution provides Broadcom's 5G Wi-Fi devices with inherent reliability and cost advantages over traditional multi-chip front-end modules."
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