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| [June 01, 2010] |
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Ralink Enters DSL Market with Complete Integrated Access Device (IAD) Designs that Include ADSL2+, 802.11n Wireless and Carrier Class Fast Ethernet
HSINCHU, Taiwan --(Business Wire)--
Ralink (News - Alert) Technology, Inc. (TAIEX:3534) (Ralink), a leading developer of
high performance wired and wireless networking solutions, today
announced its two next generation xDSL2+ 11n Wi-Fi IAD (Integrated
Access Device) solutions known as the TC3182P2V + and TC3182LEV.
Designed as an all-in-one solution for service providers looking to
provision rapidly growing markets around the globe, the TC3182x series
offers the greatest cost to performance ratio yet seen in the market.
The TC3182x series also includes a telco-class 10/100 Fast Ethernet
switch, and telecommunication standards-compliant software, all on an
industry-leading two-layer printed circuit board, offering the
industry's best price-performance "turnkey" solution.
"We are extremely pleased to see the results of Ralink's merger with
Trendchip come to fruition," said Boming Wang, General Manager of
Ralink's Broadband Business Unit. "The added depth and breadth to our
product line will allow Ralink's entry to any number of emerging markets
and allow us to compete for cross-platform deals with any networking
chip manufacturer in the world."
The next generation ADSL2+ and 802.11n CPE solution, which is applicable
for ADSL single-port 1T1R/2T2R and four-port 1T1R/2T2R 802.11n Wi-Fi
gateways, also supports a variety of peripherals via USB2.0 host
interface to meet customer demand for digital home peipherals and
applications such as connecting media server disk drives and optional 3G
connections.
Primary features for the TC3182x platform include:
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State-of-the-Art ADSL2+ chipset with PCIe interface for connections to
Wi-Fi PCIe clients ranging from low-cost 150Mpbs 1x1 2.4GHz 802.11n
all the way up to industry-leading 450Mbps 3x3 dual-band 802.11n
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Cost competitive 2-layer PCB reference design
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30% reduction in PCB size compared to competitor's solutions
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Competitive memory footprint using Ralink's LiNOS operating system
which has been optimized for "triple play" wireless-enabled Gateway (News - Alert)
and IAD applications
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Multi-threaded MIPS34Kc embedded processor for optimal VoIP and IPTV
services support
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Flexible IAD platform to fulfill Telco requirements and applications
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Integrated support for a range of voice codec solutions
"The emerging markets of China, Eastern Europe and Latin American
require low cost, high performance, tightly integrated products with
multiple on-board interface tie-ins for 3G, USB dongles and other
accessories," said Jagdish Rebello PhD, Senior Director and Principal
Analyst of market research organization iSuppli Corp. "Successful
players in this arena will be able to ride the massive adoption curve of
the burgeoning markets and the accompanying volume increases derived
from multi-platform cross-selling. Ralink seems to be targeting this
market with the TC3182x integrated Home Gateway solution."
About Ralink Technology
Ralink Technology Corporation is a leading innovator and developer of
wireless and wired chipset solutions.�The company's products are
recognized for their superior throughput, extended range, low-power
consumption, and consistent reliability. Ralink's range of patented
technologies extend Wi-Fi and wireline applications from traditional PC
networking to a variety of digital multimedia and handheld devices
including cell phones, PDAs, cameras, print servers, HDTV,�gaming
devices and set-top boxes. Ralink Technology was founded in 2001 with
headquarters in Hsinchu, Taiwan and an advanced R&D center in Cupertino,
California. For more information about Ralink please visit www.ralinktech.com
Ralink, Ralink Technology and MIMObilityTM are Ralink's
registered trademarks; All other trademarks mentioned in this document
are the property of their respective owners.

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