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Vishay Releases Industry's First 30-V Monolithic Power MOSFET and Schottky Diode With Double-Sided Cooling
(Marketwire Via Acquire Media NewsEdge) MALVERN, PA, September 24 / MARKET WIRE/ --
Vishay Intertechnology, Inc. (NYSE: VSH) today
announced the release of the industry's first 30-V monolithic power MOSFET
and Schottky diode to be offered in a package with top and bottom heat
dissipation paths for top performance in systems with forced air cooling.
Offered in the PolarPAK? package with double-sided cooling, the new
SkyFET? SiE726DF device offers increased efficiency for high-current and
high-frequency applications.
Optimized for the low-side control switch in synchronous rectification for
high-current dc-to-dc converters, VRM applications, graphics cards, and
point-of-load in servers and telecom systems, the new SiE726DF offers
exceptionally low on-resistance of 0.0024 ohms maximum at a 10-V gate drive
(0.0033 ohms maximum at 4.5 V), and can handle current levels 50 % higher
than the SO-8 in the same footprint size, without a heatsink. The device
provides a typical gate charge of 50 nC, with a low Qgd/Qgs ratio to help
prevent shoot-through.
With a Qrr of 30 nC and VSD of 0.37 V -- both of which are more than 50 %
lower than that of a standard MOSFET -- the SiE726DF integrated MOSFET and
Schottky diode increases efficiency due to less parasitics and reduced
power losses linked to the body diode of the MOSFET. As switching
frequencies increase, the reduction in power loss becomes even more
dramatic. In addition, the elimination of the external Schottky diode
allows designers to create smaller, more compact circuit designs while
reducing costs.
Link to product datasheet:
http://www.vishay.com/doc?68626 (SiE726DF)
The double-sided cooling provided by the PolarPAK package enables better
thermal performance for high-current applications. This allows for
operation with a lower junction temperature with a thermal resistance of 1
?C/W top and 1 ?C/W bottom. Its leadframe-based, encapsulated design also
offers increased protection and reliability, in addition to simplifying
manufacturing, since the die is not exposed. The device offers the same
layout regardless of die size for easier PCB design, and is 100 % Rg and
UIS tested.
Samples and production quantities of the SiE726DF are available now, with
lead times of 10 to 12 weeks for larger orders.
Vishay Intertechnology, Inc., a Fortune 1,000 Company listed on the NYSE
(VSH), is one of the world's largest manufacturers of discrete
semiconductors (diodes, rectifiers, transistors, and optoelectronics and
selected ICs) and passive electronic components (resistors, capacitors,
inductors, sensors, and transducers). These components are used in
virtually all types of electronic devices and equipment, in the industrial,
computing, automotive, consumer, telecommunications, military, aerospace,
and medical markets. Its product innovations, successful acquisition
strategy, and ability to provide "one-stop shop" service have made Vishay a
global industry leader. Vishay can be found on the Internet at
http://www.vishay.com.
SkyFET and PolarPAK are registered trademarks of Siliconix incorporated
Copyright ? 2008 Marketwire
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